GOALI: Integrated Microwave Microneedle-Electrode System For Fine Scale Material and Device Characterization

GOALI：用于精细材料和器件表征的集成微波微针电极系统

• 批准号: 1203001
• 负责人: Shekhar Bhansali
• 金额: $ 34.71万
• 依托单位: Florida International University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-08-05 至 2014-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1203001&HistoricalAwards=false
• 关键词: GOALI; Integrated; Microwave; Microneedle; Electrode

The goal of this research is to make possible the accurate mapping of the high-frequency dielectric (or impedance) properties of materials ranging from device wafers and polymeric substrates (in-line process control) to biological materials, such as human skin, at multiple depths on a fine scale. The conductive coaxial needles will be configured on a fixed-grid array and be of lengths varying from ~50-250 microns. The resulting constructs also provide a new technology to affordably produce RF probes with small separations. The reduction of probe costs (from few thousand dollars per probe to few dollars per probe) has the potential to transform RF-test protocols and enable affordable wafer level probing at a fine scale. Local integration of the electronics provides a low-noise measurement solution, but requires significant miniaturization and therefore motivates a transmission line approach with minimum leakage and cross-talk. Intellectual Merit - Existing methods for high-frequency material characterization will be refined in scale and sample density by the proposed microsystem. Unlike current techniques that provide single point measurement in the range of 100's of microns, the proposed MEMS-based approach will enable a large number of measurements (while enabling multi-point sampling via the fixed needle matrix). This research represents a new merging of MEMS and microwave-suitable sensing techniques for impedance measurements. Broader Impacts - The technology addressed in this research will impact several areas of test, measurement and systems design ranging from materials characterization to detection of impurities in wafer scale processing. The probe architectures will be suitable for high frequency metrological characterization of micron-scale devices, such as emerging mm- and sub-mm-wave transistor technologies. The fabrication techniques for producing integrated micro coaxial transmission lines will facilitate the development of 3-D microwave and mm-wave systems for sensing and communications, while simultaneously integrating sensing and packaging functions of the material. Finally, the ability for fine-scale material characterization will aid research in many materials-related areas including nano-particle thin-films, lubricants, fuels and other fluids. The research provides new opportunities for research fellows in our active training programs (Bridge to Doctorate and Alfred P. Sloan Foundation Doctoral Fellowship Program). The research outcomes will also be integrated into a new graduate level sequence at the University of South Florida that forms the core curriculum for our training grants.

这项研究的目的是使可以准确地映射从设备晶状体和聚合物基板（在线过程控制）到生物学材料（例如人类皮肤）的高频介电（或阻抗）性能，以精细的深度进行。 导电性同轴针将在固定网格阵列上配置，其长度与〜50-250微米不同。 最终的结构还提供了一种新技术，可以负担得起的RF探针，并具有较小的分离。 探测成本的降低（从每探测器几千美元增加到每笔探针的几千美元）有可能改变RF检验协议，并以良好的规模实现负担得起的晶圆水平探测。 电子设备的局部整合提供了低噪声测量解决方案，但需要大量的微型化，因此激发了以最小泄漏和串扰的传输线方法。智力优点 - 现有的高频材料表征的方法将通过拟议的微型系统在规模和样品密度上进行完善。 与提供单点测量的当前技术在100微米的范围内不同，基于MEMS的方法将实现大量测量值（同时通过固定针矩阵启用多点采样）。 这项研究代表了用于阻抗测量的MEMS和微波型感测技术的新合并。 更广泛的影响 - 本研究中解决的技术将影响测试，测量和系统设计的几个领域，从材料表征到晶圆量表处理中杂质的检测。 探针体系结构将适用于微米级设备的高频计量表征，例如新兴的MM和Sub-MM波晶体管技术。 用于生产集成微型同轴传输线的制造技术将有助于开发3-D微波和MM波系统用于感应和通信，同时同时整合了材料的传感和包装功能。 最后，精细材料表征的能力将有助于在许多与材料相关的区域进行研究，包括纳米颗粒薄膜，润滑剂，燃料和其他液体。 这项研究为我们的积极培训计划（博士学位桥梁和阿尔弗雷德·P·斯隆基金会的博士学位奖学金计划）提供了新的研究机会。研究成果还将在南佛罗里达大学的新研究生级序列中融合在一起，该序列构成了我们培训赠款的核心课程。