SBIR Phase II: Fault Isolation of Open Circuits in Semiconductor Products using Magnetic Current Imaging

SBIR 第二阶段：使用磁流成像对半导体产品中的开路进行故障隔离

• 批准号: 0924610
• 负责人: Antonio Orozco
• 金额: $ 45.64万
• 依托单位: NEOCERA, LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-09-15 至 2011-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0924610&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Fault; Isolation

This Small Business Innovation Research (SBIR) Phase II research project will enable detection of open circuit failures in semiconductor packages and integrated circuits with an accuracy of 10 microns by extending capabilities of magnetic current imaging. This has been one of the most difficult problems encountered by the industry today due to increasing complexity and shrinking of leading edge designs. The only technique available today is time domain reflectometry with practical resolution of 1-2 mm and time consuming layer-by-layer deprocessing. There is a critical need for a faster, non-destructive and more reliable technique capable of locating opens at a level commensurate with package level wiring approaching 10 microns pitch. It is proposed to use magnetic current imaging with a Superconducting Quantum Interference Device(SQUID) to solve this critical need by analyzing high frequency signals effects at the defect location. It is expected that this approach will be able to detect opens with a resolution of about 10 microns.The broader impacts of this research are: it will enable semiconductor companies to bring product to market faster and with greater reliability by rapidly finding and eliminating sources of open defects; it will benefit the nation by accelerating the introduction of advanced electronics that continuously improve quality of life for consumers, and bring opportunity gains that enhance the competitiveness of American industry.

这项小型企业创新研究（SBIR）II期研究项目将通过扩展磁电流成像的功能，以10微米的精度检测半导体套件和集成电路的开路故障。由于领先设计的复杂性和缩小，这是当今行业遇到的最困难的问题之一。当今唯一可用的技术是时间域反射仪，实际分辨率为1-2毫米，并且逐层逐步淘汰。迫切需要更快，无损和更可靠的技术能够与包装级接线接近10微米的接线以相称的水平打开。提议将磁电流成像与超导量子干扰装置（Squid）一起通过分析缺陷位置的高频信号效应来解决这一关键需求。可以预期，这种方法将能够以约10微米的分辨率检测到开放。这项研究的更广泛影响是：它将使半导体公司能够通过快速发现和消除开放缺陷来源来更快地和更大的可靠性；它将通过加速推出先进的电子产品来不断提高消费者生活质量，并带来增强美国工业竞争力的机会收益，从而使国家受益。