SBIR Phase I: Nanomaterial-Based Room Temperature Conductive Paste

SBIR第一期：纳米材料基室温导电浆料

• 批准号: 0839504
• 负责人: David Schultz
• 金额: --
• 依托单位: Seashell Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-01-01 至 2009-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0839504&HistoricalAwards=false
• 关键词: SBIR; Phase; Nanomaterial; Based; Room

This Small Business Innovative Research Phase I project will enable the development of a lead free electrical conductive adhesive(ECA) with improved mechanical and electrical properties. For the ECA to be electrically conductive, the conducting constituents need to reach a percolation threshold value, such that there is sufficient contact to form a conductive network path.Due to the human health and environmental concerns from the use of tin-lead alloy solders, electrically conductive adhesives (ECAs) are gaining use as an alternative to solder technology in micro-electrical packaging. The successful commercialization of this technology will allow the development of environmentally friendly electronics.

这个小型企业创新研究第一阶段项目将开发一种具有改进机械和电气性能的无铅导电粘合剂（ECA）。 为了使 ECA 具有导电性，导电成分需要达到渗透阈值，以便有足够的接触以形成导电网络路径。由于使用锡铅合金焊料对人类健康和环境的影响，导电粘合剂 (ECA) 作为焊接技术的替代品在微电子封装中得到广泛应用。 该技术的成功商业化将促进环保电子产品的发展。