A New Strategy for Multifunctional Polymer-based Substrates and Flexible Electronics

多功能聚合物基基板和柔性电子产品的新策略

• 批准号: 0824212
• 负责人: Angus Kingon
• 金额: $ 29.94万
• 依托单位: Brown University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-09-01 至 2012-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0824212&HistoricalAwards=false
• 关键词: New; Strategy; Multifunctional; Polymer; based

AbstractThe objective of this research is to develop and demonstrate a new approach to introduce increased functionality into high density printed wiring boards that are the primary (and ubiquitous) substrates for electronic systems. The approach is a hybrid processing scheme in which traditional low temperature processing is supplemented by processing of key components on fugitive metal foils and integration with the polymer substrates. The approach will be demonstrated by integrating an oxide thermoelectric material with the polymer substrate. The thermoelectric device will provide thermal management for a module. A second demonstration will be the integration of switching transistors on a flexible array of thermistor-based sensors. The demonstration vehicles are also designed to allow critical, basic processing and materials issues to be addressed.The intellectual merit of the project lies in the novel and elegant processing strategy for low cost substrates, while addressing a critical problem facing the electronics industry, namely that of thermal management. The project is expected to have broad impact in the electronics industry, through the dramatically increased functionality that can be achieved with the common high density printed wiring boards, and flexible electronic systems. Low cost, integrated active thermal management is also expected to impact microelectronic modules. New sensor arrays will also be enabled. Furthermore, the project will educate one female PhD student, and will be used to excite high school students into pursuing STEM careers, alert them to energy issues, and entice undergraduates into graduate engineering research programs. The project will also foster international collaboration.

摘要本研究的目的是开发和演示一种新方法，将更多功能引入高密度印刷线路板，高密度印刷线路板是电子系统的主要（且普遍存在）基板。该方法是一种混合处理方案，其中传统的低温处理辅以对短效金属箔上的关键部件进行处理以及与聚合物基板的集成。该方法将通过将氧化物热电材料与聚合物基板集成来演示。热电装置将为模块提供热管理。第二个演示是将开关晶体管集成在基于热敏电阻的传感器的灵活阵列上。演示车辆的设计还可以解决关键的基本加工和材料问题。该项目的智力优势在于针对低成本基板的新颖而优雅的加工策略，同时解决了电子行业面临的一个关键问题，即的热管理。该项目预计将通过普通高密度印刷线路板和柔性电子系统实现的功能大幅增加，从而对电子行业产生广泛影响。低成本、集成主动热管理预计也将影响微电子模块。新的传感器阵列也将启用。此外，该项目还将培养一名女博士生，并将用于激励高中生从事 STEM 职业，提醒他们注意能源问题，并吸引本科生参加研究生工程研究项目。该项目还将促进国际合作。