SBIR Phase I: Spatially selective metallization of microfabricated 3D structures and lines using Multiphoton Polymerization (MPP) for optical, photonic and electrical micro-systems

SBIR 第一阶段：使用多光子聚合 (MPP) 对光学、光子和电气微系统进行微加工 3D 结构和线条的空间选择性金属化

• 批准号: 0638055
• 负责人: Ian White
• 金额: --
• 依托单位: Focal Point Microsystems
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-01-01 至 2007-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0638055&HistoricalAwards=false
• 关键词: SBIR; Phase; Spatially; selective; metallization

This Phase I SBIR research project is directed to extending the unique 3D micro-fabrication capability of Multiphoton Induced Polymerization (MPP) technology to incorporate highly spatially selective metallization, in a three-dimensional micro-fabricated device or subsystem using a single-step fabrication process, fabricating the structure and defining the metallization sections simultaneously. Metallization and electrical conductivity are critical capabilities for any micro-fabrication technology in which the fabricated components are active elements. This creation of specific electrical paths throughout a microstructure is an intrinsic need for the extension of micro-fabrication to a truly monolithic scale of integrated components and systems by providing power delivery to components and control circuitry. The ability to do this in 3D structures enables a broad base of applications for micro-fabrication that are inaccessible with existing technologies.This proposal is directed towards extending the fabrication capabilities of MPP to include the ability to selectively position metallic paths and surfaces within such structures simultaneously with the structure formation itself. MPP's material base of organic polymers can be used in electronic, semiconductor and photonic devices. This enhanced MPP has the potential to fabricate extremely high quality optically flat surfaces without the need for polishing.

该第一阶段 SBIR 研究项目旨在扩展多光子诱导聚合 (MPP) 技术的独特 3D 微制造能力，将高度空间选择性金属化纳入使用单步制造工艺的三维微制造器件或子系统中，同时制造结构并定义金属化部分。金属化和导电性是任何微制造技术的关键能力，其中制造的元件是有源元件。通过向组件和控制电路提供电力传输，在整个微结构中创建特定的电气路径是微制造扩展到集成组件和系统的真正单片规模的内在需求。在 3D 结构中实现这一点的能力为现有技术无法实现的微制造应用提供了广泛的基础。该提案旨在扩展 MPP 的制造能力，包括在此类结构内选择性定位金属路径和表面的能力与结构形成本身同时进行。 MPP的有机聚合物材料基础可用于电子、半导体和光子器件。这种增强型 MPP 具有无需抛光即可制造极高品质光学平坦表面的潜力。