STTR Phase I: Fully Embedded Optical Interconnect Layers Based on Molded Polymer Lightwave Components for Large Field Size Printed Circuit Boards

STTR 第一阶段：用于大面积印刷电路板的基于模制聚合物光波组件的完全嵌入式光学互连层

• 批准号: 0539538
• 负责人: Wei Jiang
• 金额: $ 10万
• 依托单位: Omega Optics, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-01-01 至 2006-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0539538&HistoricalAwards=false
• 关键词: STTR; Phase; Fully; Embedded; Optical; STTR; Phase; Fully; Embedded; Optical

This Small Business Technology Transfer (STTR) Phase I project aims at developing a commercially viable optical interconnect technology. Conventional optical interconnect technologies suffer from planar optical waveguides with small dimensions in the vertical direction, which leads to alignment difficulties, laser coupling efficiency reduction, and deteriorated packaging reliability. These optical interconnect technologies also fail to provide transmission over a large field size, and the insertion of optical interconnects is incompatible with electronic device packaging. In this program, it is proposed to develop a fully embedded optical interconnection layer within the three dimensional (3D) electrical interconnect layers using molded optical waveguides in conjunction with thin film lasers and thin film photodetectors (both ~ 10 micron in thickness). The selection of polymer based molded waveguides solves two pending problems, the small field size of the interconnects and the shallow depth of the waveguides. The proposers intend to demonstrate up to 24"x36" molded waveguide films having waveguide dimensions of 50 microns by 50 microns, which make the alignment, and therefore packaging, of laser diodes and photodetectors highly reliable. Such a waveguide depth is not economically feasible using any other waveguide technologies.Commercially, using current communication devices, future data transmission demands at the printed circuit board and system level will be difficult to achieve with current copper interconnect technology due to issues regarding signal attenuation, electromagnetic interference, and parasitic noise. The state of the art electrical interconnect technology is anticipated to hit a deadlock between 2008 and 2012 at speeds above 10Gb/s. The proposed research provides a unique solution that reliably incorporates the optical interconnects into printed circuit board (PCB) fabrication and integration. The result of this research program will lay a solid foundation for a future PCB industry, which is critical for the United States to lead the market for the years to come.

这项小型企业技术转移（STTR）I阶段项目旨在开发一种商业上可行的光学互连技术。常规的光学互连技术遭受平面光波指导的垂直方向尺寸较小，这会导致对齐困难，激光偶联效率降低以及包装可靠性降低。这些光学互连技术也无法在较大的场尺寸上提供传输，并且光学互连的插入与电子设备包装不相容。在该程序中，建议在三维（3D）电气互连层中开发完全嵌入的光学互连层，并使用模制的光学波导与薄膜激光器和薄膜光电镜（厚度约为10微米）结合使用。基于聚合物的模制波导的选择解决了两个待处理的问题，即互连的小场大小和波导的浅深度。提议者打算在50微米（50微米）的波导尺寸上表现出多达24“ X36”模制的波导膜，从而使激光二极管和光电探测器的对齐和包装非常可靠。使用任何其他波导技术，这种波导深度在经济上是不可行的。在当前的铜互连技术上，由于当前的铜互连技术，由于有关信号衰减，电磁干扰和寄生虫噪声而引起的当前铜互连技术，因此很难实现印刷电路板的未来数据传输需求。预计最新的电气互连技术将以超过10GB/s的速度在2008年至2012年之间发生僵局。拟议的研究提供了一种独特的解决方案，可可靠地将光学互连纳入印刷电路板（PCB）制造和集成中。该研究计划的结果将为未来的PCB行业奠定坚实的基础，这对于美国领导市场至今的市场至关重要。