SBIR Phase I: Heat Conduction in Thin Films: Modeling and Experiments

SBIR 第一阶段：薄膜中的热传导：建模和实验

基本信息

批准号：
9960172
负责人：
Sandip Mazumder
金额：
$ 10万
依托单位：
CFD RESEARCH CORPORATION
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
1999
资助国家：
美国
起止时间：
1999-10-01 至 2000-03-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=9960172&HistoricalAwards=false
关键词：
SBIR Phase Heat Conduction Thin

项目摘要

This Small Business Innovation Research (SBIR) Phase I is aimed at developing a multi-dimensional Monte Carlo model to simulate micro-scale heat transfer in thin films. The proposed study will develop a multi-dimensional Monte Carlo model for the solution of the Boltzmann Transport Equation (BTE) with the inclusion of all possible phonon scattering mechanisms and appropriate nonlinear dispersion relationships for frequency-dependent group velocity for phonon density of states. As part of the study, simulations will be performed for single crystal materials with known dispersion relationships. The model will be validated in part against available experimental data and in part against experiments conducted at the University of California at Berkeley (UCB) under a sub-contract. The Phase II study will extend the model to study single crystal superlattice structures and will focus on integrating the micro-scale models into an existing commercial software, CFD-ACE+, to enable simulation of heat transfer in microelectronic and MEMS devices.The proposed study will result in a computational tool to aid in the design and fabrication of IC and MEMS devices that use thin films of dielectric and semiconductor materials. The simulation tool will enable the design of devices with optimal thermal performance (and increased reliability) and thus reduce potential device/system failures resulting from poor heat transfer.

这项小型企业创新研究（SBIR）I阶段旨在开发多维蒙特卡洛模型，以模拟薄膜中的微尺度传热。拟议的研究将开发一个多维的蒙特卡洛模型，用于玻尔兹曼传输方程（BTE）的溶液，其中包括所有可能的声子散射机制和适当的非线性分散关系，以用于频率依赖性组速度的状态声子密度。作为研究的一部分，将对具有已知分散关系的单晶材料进行仿真。该模型将部分根据可用的实验数据进行验证，部分地反对在分包合同下在加利福尼亚大学伯克利分校（UCB）进行的实验。 II期研究将扩展模型以研究单晶超级晶格结构，并将重点放在将微尺度模型集成到现有的商业软件CFD-ACE+中，以启用微电子和MEMS设备中的热传递。导致一种计算工具，以帮助使用介电和半导体材料的薄膜的IC和MEMS设备的设计和制造。仿真工具将使设备的设计具有最佳的热性能（以及可靠性提高），从而减少了由于传热不良而导致的潜在设备/系统故障。