International Workshop on Defect and Fault Tolerance in VLSI Systems; October 6-7, 1988; Springfield, Massachusetts

超大规模集成电路系统缺陷和容错国际研讨会；

• 批准号: 8803418
• 负责人: Israel Koren
• 金额: $ 0.55万
• 依托单位: University of Massachusetts Amherst
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1988
• 资助国家: 美国
• 起止时间: 1988-07-01 至 1988-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=8803418&HistoricalAwards=false
• 关键词: International; Workshop; Defect; Fault; Tolerance

The workshop addresses problems on defect tolerance and fault tolerance in complex VLSI (Very Large Scale Integration) and WSI (Wafer Scale Integration) systems. Its objective is to bring together researchers and designers in the above problem areas with developers of appropriate computer-aided design (CAD) tools and innovative packaging techniques. Its scope includes (a) defect and fault tolerant computer architectures; (b) defect and fault tolerant memories; (c) techniques for yield enhancements; (d) fault models and defect models; (e) statistical modeling of defects and yield; (f) repair and restructuring techniques; (g) packaging technologies for WSI and 3-D VLSI circuits; (h) high density hybrid circuits; (i) CAD tools; and (j) experimental systems. The research will bring together researchers and practitioners in both industry and academia in the U.S. and abroad to discuss problems on fabrication defects, yield models, and chip designs for yield enhancement. It will foster better interactions between industry and academia in understanding fabrication defects and developing defect tolerant and fault tolerant techniques and systems. The program committee consists of distinguished researchers in academia and industry. The workshop organizers have done extensive research in this area and are well respected in the problem areas addressed by the workshop. The grant funded by the National Science Foundation will be used to support travel for a keynote speaker and the printing cost of proceedings for conference attendees. Without the support from NSF, the cost of registration will be exceedingly high for the limited number of workshop attendees. Support is, therefore, highly recommended.

该研讨会解决复杂的 VLSI（超大规模集成）和 WSI（晶圆级集成）系统中的缺陷容错和容错问题。 其目标是将上述问题领域的研究人员和设计人员与适当的计算机辅助设计 (CAD) 工具和创新封装技术的开发人员聚集在一起。 其范围包括 (a) 缺陷和容错计算机体系结构； (b) 缺陷和容错存储器； (c) 提高产量的技术； (d) 故障模型和缺陷模型； (e) 缺陷和产量的统计模型； (f) 修复和重组技术； (g) WSI和3D VLSI电路的封装技术； (h) 高密度混合电路； (i) 计算机辅助设计工具； (j) 实验系统。 该研究将汇集美国和国外工业界和学术界的研究人员和从业者，讨论制造缺陷、良率模型和提高良率的芯片设计等问题。 它将促进工业界和学术界之间更好的互动，了解制造缺陷并开发容错和容错技术和系统。 程序委员会由学术界和工业界的杰出研究人员组成。 研讨会组织者在该领域进行了广泛的研究，并在研讨会解决的问题领域受到了广泛的尊重。 美国国家科学基金会资助的赠款将用于支持主讲人的旅费和与会者的会议记录印刷费用。 如果没有 NSF 的支持，对于数量有限的研讨会参加者来说，注册费用将会非常高。 因此，强烈建议提供支持。