Advanced Cooling Technologies for Microsystems

微系统的先进冷却技术

• 批准号: 576747-2022
• 负责人: Sylvestre, JulienJ
• 金额: $ 7.29万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=754374
• 关键词: Advanced; Cooling; Technologies; Microsystems

The goal of the proposed project is to create innovative high-performance solutions for the cooling of high power electronic components, by continuing the development of a highly efficient research partnership with Systemex Energies and East-West Manufacturing. The outcomes of the proposed project will comprise reliable technologies that are compatible with modern manufacturing infrastructures and that provide an economical path to meeting the growing demand for energy-efficient data centers and for very high power microprocessors. The principal new concepts in the proposed research are to use a new electroplated porous copper coating in low-pressure closed thermosiphons to achieve state-of-the-art performance in air-cooled microprocessors. The proposed research will thus fill knowledge gaps on the reliability, design methodologies and proper manufacturing techniques of these thermosiphons, as well as gaps on flows in microfabricated devices used to optimize energy management.

拟议项目的目标是通过继续与 Systemex Energies 和 East-West Manufacturing 建立高效的研究合作伙伴关系，为高功率电子元件的冷却创建创新的高性能解决方案。拟议项目的成果将包括与现代制造基础设施兼容的可靠技术，并提供经济的途径来满足对节能数据中心和超高功率微处理器日益增长的需求。 拟议研究中的主要新概念是在低压封闭热虹吸管中使用新型电镀多孔铜涂层，以实现风冷微处理器的最先进性能。因此，拟议的研究将填补这些热虹吸管的可靠性、设计方法和适当制造技术方面的知识空白，以及用于优化能源管理的微加工设备中的流动方面的空白。