Fully-integrated resonant micro-devices for next-generation electronic systems

用于下一代电子系统的完全集成谐振微器件

• 批准号: RGPIN-2017-05147
• 负责人: Cicek, PaulVahe
• 金额: $ 1.75万
• 依托单位: Université du Québec à Montréal
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=679742
• 关键词: Fully; integrated; resonant; micro; devices

Nowadays, in several commercial sectors such as Consumer Electronics, Automotive and Industrial, microelectromechanical systems (MEMS) have established themselves as an essential vector in enabling an effective interface between the user, the environment and a system's electronic "brain". Particularly, resonant-type MEMS devices have been widely demonstrated to fulfill high-performance tasks including electrical signal filtering, inertial sensing, ultrasonic transduction and gas detection. However, MEMS technology has yet to achieve its full disruptive potential because it is still predominantly restricted to discrete integration schemes for inclusion within complex electronic systems. Indeed, the lack of viable methods for monolithically integrating MEMS and integrated circuits (IC) imposes functional, performance-related, and economic limitations on commercial products such as: *** the inability to incorporate several MEMS devices of similar or different class onto a single IC die;*** larger system size resulting from multiple dice;*** high power consumption because of the electrical parasitic effects related to the interconnections between multiple dice;*** greater costs (e.g., materials, processing, logistics) due to separate IC and MEMS fabrication on distinct dice.******Consequently, the proposed research program attempts to discover and propose answers to the question: How can current technological limitations be overcome in order to enable fully-monolithic next generation systems incorporating IC and MEMS?******Founding this program on prior advances realized towards monolithic integration, we hold that solving our research question revolves around the long-term objective (LTO) of exploring optimal approaches for above-IC integration of resonant MEMS. Advancing knowledge along this LTO is expected, at term, to provide system designers with a methodology and technological framework for seamlessly incorporating MEMS as lumped-cell elements on IC. This LTO will be attained by means of two short-term objectives (STO): to propose novel topologies for optimal resonant MEMS incorporating piezoelectric actuation, and to elaborate a novel fabrication platform technology for optimal IC integration of resonant MEMS. The viability of the proposed methods will be assessed by a third STO: to demonstrate novel integrated resonant devices using the elaborated topologies and fabrication platform.******With a second LTO of providing HQP with multi-disciplinary expertise in microtechnologies, this research program is expected to exert a disruptive impact on the approach, methods and techniques used for designing and producing electronics-based commercial products. As such, the outcomes of this work will provide long-lasting value to Canada's society, industry and research community.

如今，在几个商业领域，例如消费电子，汽车和工业，微电动机械系统（MEMS）已将自己确立为在启用用户，环境和系统的电子“大脑”之间有效接口的重要矢量。特别是，已广泛证明了共振型MEMS设备，以实现高性能任务，包括电信号滤波，惯性传感，超声转导和气体检测。但是，MEMS技术尚未实现其充分的破坏潜力，因为它仍然主要限于离散的集成方案，以包含在复杂的电子系统中。实际上，缺乏单一整合的可行方法和集成电路（IC）施加功能，性能相关，以及对商业产品的经济限制，例如：***无法将相似或不同类别的几个MEM设备纳入单个​​IC模具上的几个类似或不同类别的iC模具; ***较大的系统尺寸较大的多个动力; ***高电动型; ***较大的互联性; （例如，材料，处理，物流）由于在不同的骰子上分开的IC和MEMS制造。探索最佳方法的长期目标（LTO），用于谐振内存的高度整合。可以从该LTO促进知识，从而期望为系统设计人员提供一个方法和技术框架，以无缝将MEMS纳入IC上的大细胞元素。该LTO将通过两个短期目标（STO）实现：提出新的拓扑，以结合压电驱动的最佳共振mem，并阐述一种新型的制造平台技术，以最佳的IC整合resonant Mems。提出的方法的可行性将通过第三个STO进行评估：使用精心设计的拓扑和制造平台展示新型的集成共振设备。******，第二次提供了与Microtechnologies的多学科专业知识相关的LTO，该研究计划预计该研究计划将对方法和技术产生破坏性影响，方法和技术供应构成技术和技术。因此，这项工作的结果将为加拿大的社会，工业和研究社区带来长期的价值。