Microwave sintering of ink-jet printed copper nanoparticles
喷墨印刷铜纳米粒子的微波烧结
基本信息
- 批准号:538444-2018
- 负责人:
- 金额:$ 1.37万
- 依托单位:
- 依托单位国家:加拿大
- 项目类别:Collaborative Research and Development Grants
- 财政年份:2019
- 资助国家:加拿大
- 起止时间:2019-01-01 至 2020-12-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Additive manufacturing holds the promise for a change of paradigm in fast prototyping and end-consumer fabrication and is no longer restricted to mechanical components rather than a much broader variety products including electronics through printing of electronic circuitry. This emerging technology has already reached industrial maturity e.g. for displays where roll-to-roll (R2R) printing for organic electronics is now becoming standard while it is still in its infancy for other critical electronic components such as non-volatile memories for which our team has been the first to demonstrate a fully printable design in 2017. In order to accelerate the production process, the rate limiting process step at the moment is the sintering of several components and while it is in principle possible to replace some by alternatives that do not require sintering, such a replacement implies design or performance restrictions so that, as one option, faster sintering schemes are taken into consideration. With thermal sintering being the slowest and least selective option, flash light sintering provides a more selective yet substantially more expensive alternative. The purpose of this project is to determine the potential of microwave sintering that would combine the speed of flash light at expenses similar to thermal sintering, which is orders of magnitude more affordable than flash light sintering. Different parameters such as the absorbance of metal nanoparticle inks as a function of layer thickness, the effect of reducing agents and the design of a microwave resonator for sufficiently strong intensities are investigated and the outcome verified by means of SEM, atomic force microscopy and four-point electrical characterization.
增材制造有望改变快速原型制作和最终消费者制造的范式,并且不再局限于机械部件,而是包括通过电子电路印刷的电子产品在内的更广泛的产品。这种新兴技术已经达到工业成熟度,例如用于有机电子产品的卷对卷 (R2R) 印刷现已成为标准的显示器,而对于其他关键电子元件(例如非易失性存储器)来说,它仍处于起步阶段,我们的团队是第一个展示完全可印刷的2017 年设计。为了加速生产过程,目前的速率限制工艺步骤是烧结多个组件,虽然原则上可以用不需要烧结的替代品替换某些组件,但这种替换意味着设计或表现限制,因此作为一种选择,考虑更快的烧结方案。由于热烧结是最慢且选择性最少的选择,闪光灯烧结提供了一种更具选择性但成本更高的替代方案。该项目的目的是确定微波烧结的潜力,它将结合闪光灯的速度,而费用类似于热烧结,这比闪光灯烧结便宜几个数量级。研究了不同的参数,例如金属纳米粒子墨水的吸光度与层厚度的函数关系、还原剂的影响以及足够强强度的微波谐振器的设计,并通过 SEM、原子力显微镜和四相显微镜验证了结果。点电气特性。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Ruediger, Andreas其他文献
Ruediger, Andreas的其他文献
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{{ truncateString('Ruediger, Andreas', 18)}}的其他基金
Optical near-field study of ferroelectric tunnel junctions
铁电隧道结的光学近场研究
- 批准号:
RGPIN-2019-07023 - 财政年份:2022
- 资助金额:
$ 1.37万 - 项目类别:
Discovery Grants Program - Individual
Optical near-field study of ferroelectric tunnel junctions
铁电隧道结的光学近场研究
- 批准号:
RGPIN-2019-07023 - 财政年份:2022
- 资助金额:
$ 1.37万 - 项目类别:
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开发用于集成电子电路的模块化卷2卷印刷系统
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$ 1.37万 - 项目类别:
Collaborative Research and Development Grants
Optical near-field study of ferroelectric tunnel junctions
铁电隧道结的光学近场研究
- 批准号:
RGPIN-2019-07023 - 财政年份:2021
- 资助金额:
$ 1.37万 - 项目类别:
Discovery Grants Program - Individual
Optical near-field study of ferroelectric tunnel junctions
铁电隧道结的光学近场研究
- 批准号:
RGPIN-2019-07023 - 财政年份:2021
- 资助金额:
$ 1.37万 - 项目类别:
Discovery Grants Program - Individual
Development of a modular roll-2-roll printing system for integrated electronic circuitry
开发用于集成电子电路的模块化卷2卷印刷系统
- 批准号:
543965-2019 - 财政年份:2021
- 资助金额:
$ 1.37万 - 项目类别:
Collaborative Research and Development Grants
Development of a modular roll-2-roll printing system for integrated electronic circuitry
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- 资助金额:
$ 1.37万 - 项目类别:
Collaborative Research and Development Grants
Development of a modular roll-2-roll printing system for integrated electronic circuitry
开发用于集成电子电路的模块化卷2卷印刷系统
- 批准号:
543965-2019 - 财政年份:2020
- 资助金额:
$ 1.37万 - 项目类别:
Collaborative Research and Development Grants
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RGPIN-2019-07023 - 财政年份:2020
- 资助金额:
$ 1.37万 - 项目类别:
Discovery Grants Program - Individual
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529606-2018 - 财政年份:2020
- 资助金额:
$ 1.37万 - 项目类别:
Collaborative Research and Development Grants
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