Materials, Device, And Interface Engineering for Non-Conventional Electronics by Hard/Soft Material Integration

通过硬/软材料集成实现非常规电子产品的材料、器件和接口工程

• 批准号: 435914-2013
• 负责人: Chung, HyunJoong
• 金额: $ 1.82万
• 依托单位: University of Alberta
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2018
• 资助国家: 加拿大
• 起止时间: 2018-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=647719
• 关键词: Materials; Device; Interface; Engineering; Non

Integrating materials with complementary properties have created new opportunities for producing structural and functional materials. For example, one can achieve mechanical flexibility with high-performance inorganic devices (which are traditionally thought of as brittle) by employing polymeric materials as matrices. The key to achieving this feat lays in carefully integrating micro- and/or nano-sized inorganic device components into a soft material matrix, while maintaining excellent device performance. Novel form factors, such as bendable, foldable, and rollable electronics have been realized through the marriage between hard and soft materials. The current stage of innovative research is on stretchable electronics, where neural interfaces, electronic muscles, and energy harvesters show immense potential. Developing stretchable devices with long-term operational stability is challenging because the electronics must withstand severe strain and volume change during operation. Consequently the major sources of device failure are crack and debonding at the interface between hard and soft materials. The short-term objective of the proposed DG program is to prevent these mechanical failure modes at the interface by controlling the material's morphology and chemistry at the interface. The methodologies come from the disciplines of polymer physics and nanofabrication and are inspired by biology. My research group's long-term goal is to devise conceptually new electronic systems with unprecedented form factors. Independent research on novel soft material matrices as well as micro- and nano-devices will also be performed in parallel. The long-term objective of the DG program is to study various phenomena at the interface between the operating devices and the novel soft material matrix. From a big-picture perspective, the knowledge gained from the DG program will also be applicable to wide range of engineering disciplines such as polymers, composite materials, MEMS, interface science, and bioelectronics. When system-level integration is realized, these non-conventional electronics will serve as novel tools with broad application in fields such as medical therapy, food engineering, and biomedical science.**

将材料与互补特性相结合为生产结构和功能材料创造了新的机会。例如，通过采用聚合物材料作为基体，可以通过高性能无机器件（传统上被认为是脆性的）实现机械柔性。 实现这一壮举的关键在于将微米和/或纳米尺寸的无机器件组件仔细地集成到软材料基体中，同时保持优异的器件性能。 通过硬质材料和软质材料的结合，可弯曲、可折叠和可卷曲的电子产品等新颖的外形尺寸得以实现。 当前阶段的创新研究是可拉伸电子产品，其中神经接口、电子肌肉和能量采集器显示出巨大的潜力。 开发具有长期运行稳定性的可拉伸设备具有挑战性，因为电子设备必须承受运行过程中的严重应变和体积变化。 因此，器件故障的主要来源是硬材料和软材料之间界面处的裂纹和脱粘。 所提出的 DG 计划的短期目标是通过控制界面处材料的形态和化学性质来防止界面处的这些机械故障模式。 这些方法来自聚合物物理和纳米制造学科，并受到生物学的启发。 我的研究小组的长期目标是设计具有前所未有的外形尺寸的概念性新电子系统。 对新型软材料基体以及微米和纳米器件的独立研究也将同时进行。 DG 项目的长期目标是研究操作设备和新型软材料基体之间界面的各种现象。 从大局来看，从 DG 项目中获得的知识也将适用于广泛的工程学科，如聚合物、复合材料、MEMS、界面科学和生物电子学。 当系统级集成实现时，这些非常规电子产品将成为在医学治疗、食品工程和生物医学等领域广泛应用的新型工具。 **