Microfabrication of compact wireless devices in very thick materials

使用非常厚的材料微加工紧凑型无线设备

基本信息

批准号：
216835-2012
负责人：
Klymyshyn, David
金额：
$ 3.06万
依托单位：
University of Saskatchewan
依托单位国家：
加拿大
项目类别：
Discovery Grants Program - Individual
财政年份：
2017
资助国家：
加拿大
起止时间：
2017-01-01 至 2018-12-31
项目状态：
已结题

来源：
https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=637611
关键词：
Microfabrication compact wireless devices very

项目摘要

Wireless devices represent multi-billion dollar industries in Canada, and drive our lives and economy like never before with a desire for tiny communication and sensor devices and networks that are changing the way we interact with each other and gather data about the environment around us. The relentless pursuit of device miniaturization for such systems often comes at the price of compromised performance, at a time when the requirement is for increased functionality. One of the biggest obstacles to further miniaturization of wireless devices is the passive circuit elements responsible for signal conditioning, and also the radiating antenna element. These passive structures account for a large portion of the size. This project is an international collaboration, proposing a radically different approach to fabrication of compact wireless devices using non-traditional ultra-thick polymer-based materials, enabling improved performance and increased functionality for various emerging wireless communication devices, automotive radar systems, small satellites, RF identification, and sensors/biosensors. Specialized techniques for microfabrication of high performance wireless structures using synchrotron-based deep X-ray lithography will be used to fabricate very tall structures (up to millimetres), in thick metal, polymer, and polymer-dielectric composite layers, with high-aspect-ratios and exceptional structural features down to the micrometer range. Lithography will be used to directly fabricate dielectric resonator antenna elements and combine these with tall embedded metal structures and circuits for the first time, to realize vertical integrated wireless devices with new capabilities and enhanced functional properties.

无线设备代表了加拿大数十亿美元的行业，并以对微小的沟通，传感器设备和网络的渴望来推动我们的生活和经济。在要求提高功能性的情况下，对这种系统的设备小型化的不懈追求通常是以损害性能的代价。无线设备的进一步微型化的最大障碍之一是负责信号调节的被动电路元件以及辐射天线元件。这些被动结构占大部分的大部分。该项目是一项国际合作，提出了一种完全不同的方法，可以使用非传统的超厚聚合物材料来制造紧凑的无线设备，从而提高了性能并提高各种新兴无线通信设备，汽车雷达系统，小卫星，小卫星，小卫星，小卫星，小卫星，， RF识别以及传感器/生物传感器。使用基于同步加速器的深X射线光刻的高性能无线结构进行微结构的专业技术将用于制造非常高的结构（最多可达到毫米），厚金属，聚合物和聚合物 - 二聚体复合层，具有高光谱层，比率和特殊的结构特征降至千分尺范围。光刻将用于直接制造介电谐振器天线元件，并首次将它们与高的嵌入式金属结构和电路相结合，以实现具有新功能和增强功能性能的垂直集成无线设备。