Microfabrication of compact wireless devices in very thick materials

使用非常厚的材料微加工紧凑型无线设备

• 批准号: 216835-2012
• 负责人: Klymyshyn, David
• 金额: $ 3.06万
• 依托单位: University of Saskatchewan
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2014
• 资助国家: 加拿大
• 起止时间: 2014-01-01 至 2015-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=546452
• 关键词: Microfabrication; compact; wireless; devices; very

Wireless devices represent multi-billion dollar industries in Canada, and drive our lives and economy like never before with a desire for tiny communication and sensor devices and networks that are changing the way we interact with each other and gather data about the environment around us. The relentless pursuit of device miniaturization for such systems often comes at the price of compromised performance, at a time when the requirement is for increased functionality. One of the biggest obstacles to further miniaturization of wireless devices is the passive circuit elements responsible for signal conditioning, and also the radiating antenna element. These passive structures account for a large portion of the size.

无线设备代表着加拿大价值数十亿美元的产业，并以前所未有的方式推动我们的生活和经济发展，人们对微型通信、传感器设备和网络的渴望正在改变我们彼此互动的方式，并收集有关我们周围环境的数据。当需要增加功能时，对此类系统设备小型化的不懈追求往往是以牺牲性能为代价的。无线设备进一步小型化的最大障碍之一是负责信号调节的无源电路元件以及辐射天线元件。这些被动结构占了很大一部分尺寸。