Wireless Integrated Circuits for the Era of 6G: System-in-a-Package

6G时代的无线集成电路：系统级封装

• 批准号: FT230100104
• 负责人: Dr Xi (Forest) Zhu
• 金额: $ 60.11万
• 依托单位: University of Technology Sydney
• 依托单位国家: 澳大利亚
• 项目类别: ARC Future Fellowships
• 财政年份: 2024
• 资助国家: 澳大利亚
• 起止时间: 2024-06-30 至 2028-06-29
• 项目状态: 未结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/FT230100104
• 关键词: Wireless; Integrated; Circuits; Era; 6G

The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.

该项目的目的是结合硅和化合物半导体技术，为未来的无线集成电路构建硬件基础。该项目将产生电路设计和系统集成知识，以转向新兴 6G 技术的工程。预期成果包括使用多种半导体技术的封装收发器以及自主设计能力的开发。该结果将构成实施 6G 的重要一步。为澳大利亚带来的好处包括早期职业工人的发展、知识产权的产生以及通过应用这一下一代技术为澳大利亚人确保社会和经济利益。