Nanoscale 3D transfer printing for hybrid photonic device fabrication

用于混合光子器件制造的纳米级 3D 转移打印

• 批准号: 2110910
• 金额: --
• 依托单位: University of Strathclyde
• 依托单位国家: 英国
• 项目类别: Studentship
• 财政年份: 2018
• 资助国家: 英国
• 起止时间: 2018 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=studentship-2110910
• 关键词: Nanoscale; 3D; transfer; printing; hybrid

Chip scale photonic systems have seen a rapid uptake in a wide range of applications from lab-on-a-chip biosensors to ultra-high speed micro-displays and photonic integrated circuitry. This explosion of new functionalities has been enabled by the availability of mature chip scale platforms, including III-V's, silicon, organics and glass. The commercialization of the material platforms, and the leveraging of existing fabrication technologies, notably from the integrated electronics community, has enabled researchers to explore large scale integration of optoelectronic devices.

从实验室芯片生物传感器到超高的速度微分机和光子集成电路的广泛应用，芯片刻度光子系统已经在广泛的应用中迅速吸收。通过包括III-V，硅，有机物和玻璃在内的成熟芯片尺度平台的可用性，已经实现了新功能的这种爆炸。物料平台的商业化以及现有制造技术的利用，特别是来自集成电子界的商业化，使研究人员能够探索光电设备的大规模集成。