High-Density Liquid Crystal Polymer Cochlear Electrodes

高密度液晶聚合物耳蜗电极

• 批准号: 6657260
• 负责人: SCOTT S CORBETT
• 金额: $ 34.95万
• 依托单位: ADVANCED COCHLEAR SYSTEMS, INC.
• 依托单位国家: 美国
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-07-01 至 2004-09-08
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/6657260
• 关键词: biomedical equipment development; cats; cochlear implants; electrodes; liquid crystal; medical implant science; method development; polymers

DESCRIPTION (provided by applicant): In this project, high-density cochlear electrode arrays will be fabricated utilizing liquid crystal polymer (LCP) a new electronic substrate material with mechanical and electrical properties potentially well suited for advanced array fabrication and implantation. Advanced multi-layer circuit fabrication techniques incorporating blind and through-hole UV laser drilled micro-via arrays, will be utilized, increasing the number of channels and density over current generation electrodes. These arrays will exhibit significantly improved performance over current generation electrode arrays, which are made using laborious hand fabrication techniques and have limited numbers of channels. Recent developments in processor and implantation techniques demonstrate that field steering methods combined with closer placement of the array to the modilar wall in the cochlea can reduce channel interaction, motivating increasing the number of independent channels in such devices to improve performance. These arrays will support advanced processing strategies including field steering techniques and parallel, high rate, phase coherent stimulation being developed by Advanced Cochlear Systems. The new arrays combined with new processing technologies and greater pulse delivery rates made possible by field control and electrode placement may permit the delivery of two to three orders of magnitude greater information than is provided by available cochlear implant systems.

描述（由申请人提供）：在此项目中，使用液晶聚合物（LCP）制造高密度的耳蜗电极阵列，一种新的电子基板材料，具有机械和电气性能，可能非常适合于高级阵列制造和植入。将利用具有盲和整孔紫外线钻孔钻机钻机阵列的高级多层电路制造技术，以增加当前一代电极的通道和密度的数量。这些阵列将与当前一代电极阵列相比，其性能明显提高，这些阵列是使用费力的手工制造技术制成的，并且通道数量有限。处理器和植入技术的最新发展表明，将阵列在耳蜗中更紧密地放置在阵列上的现场转向方法可以减少通道相互作用，从而激发此类设备中独立通道的数量增加，以提高性能。这些阵列将支持先进的处理策略，包括现场转向技术和由高级耳蜗系统开发的平行，高率，相干刺激。新的阵列与新的处理技术和更高的脉冲输送率相结合，可以通过现场控制和电极放置使得与可用的耳蜗植入物系统所提供的两到三个数量级的交付可能更大。