Q-dot-Glass based Thermoelectric Cooling (Q-Dot-TEC) by Thermal Energy Harvesting

基于 Q-dot-Glass 的热能收集热电冷却 (Q-Dot-TEC)

基本信息

批准号：
EP/X032612/1
负责人：
GEETA SHARMA
金额：
$ 26万
依托单位：
University of Leeds
依托单位国家：
英国
项目类别：
Fellowship
财政年份：
2023
资助国家：
英国
起止时间：
2023 至无数据
项目状态：
未结题

来源：
https://gtr.ukri.org/projects?ref=EP%2FX032612%2F1
关键词：
dot Glass based Thermoelectric Cooling

项目摘要

The technology has evolved drastically over various stages of industrial revolution from usage of coal, steam and water to current stage chip technology, artificial intelligence and big data which relies on lots of data transfer (5G). With data as new oil, data centres will need large storage capacities which in turn increases power consumption of ICT sector. The energy demand in ICT sector implies that global carbon footprint for increasing the capacity of digital infrastructure may become unsustainable at a current rate in future!Hence the present proposal aims to develop a novel single platform technology using on-chip energy harvesting of heat dissipated by electronic and photonic chips during their operation. The future of manufacturing PICs will adapt with the software design options by incorporating on-chip thermal management programme, which will then become a part of the chip substrate and component assembly process using the advanced robotic technology. The missing feature in robotically controlled integration has been thermal management engineering and its implementation on chip at low cost and power budget. Our methodology is based on engineering a unique chip using Q-dot doped glass during manufacturing. This chip will constitute Q-dot glass layer on SOI substrate, followed by selective growth of n- and p-type semiconductor layers on it. The heat dissipated from operating components will be absorbed by Qdot glass which then be transferred to adjoining n and p-type semiconducting layers for the generation of charge carriers. These charge carriers will generate current. This project will be a cross-disciplinary project which aims to provide solution for an outstanding problem of heat dissipation in the existing chip technology (electronic and the PICs) and future energy crisis using (i) Materials synthesis and deposition ii) Materials characterizations iii) Device based characterisation iv) Manufacturability of the thermal energy harvesting devices.

该技术在工业革命的各个阶段经历了巨大的发展，从煤炭、蒸汽和水的使用到当前阶段依赖大量数据传输的芯片技术、人工智能和大数据（5G）。数据就像新的石油，数据中心将需要大量的存储容量，这反过来又增加了ICT行业的功耗。 ICT 领域的能源需求意味着，未来以目前的速度，用于增加数字基础设施容量的全球碳足迹可能变得不可持续！因此，本提案旨在开发一种新颖的单一平台技术，利用片上能量收集技术散发的热量。电子和光子芯片在运行期间。制造 PIC 的未来将通过整合片上热管理程序来适应软件设计选项，然后该程序将成为使用先进机器人技术的芯片基板和组件组装过程的一部分。机器人控制集成中缺少的功能是热管理工程及其以低成本和功耗预算在芯片上的实现。我们的方法基于在制造过程中使用 Q 点掺杂玻璃设计独特的芯片。该芯片将在SOI基板上构成Q点玻璃层，然后在其上选择性生长n型和p型半导体层。工作部件散发的热量将被 Qdot 玻璃吸收，然后转移到相邻的 n 型和 p 型半导体层以产生电荷载流子。这些电荷载流子将产生电流。该项目将是一个跨学科项目，旨在通过 (i) 材料合成和沉积 ii) 材料表征 iii) 为现有芯片技术（电子和 PIC）中突出的散热问题和未来的能源危机提供解决方案基于设备的表征 iv) 热能收集设备的可制造性。