SUB-WAVELENGTH HOLOGRAPHIC LITHOGRAPHY STEPPER FOR INTEGRATED CIRCUIT PRODUCTION (HoliSTEP)

用于集成电路生产的亚波长全息光刻步进机 (HoliSTEP)

• 批准号: 10102121
• 金额: $ 29.41万
• 依托单位: MODUS RESEARCH AND INNOVATION LIMITED
• 依托单位国家: 英国
• 项目类别: EU-Funded
• 财政年份: 2024
• 资助国家: 英国
• 起止时间: 2024 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=10102121
• 关键词: SUB; WAVELENGTH; HOLOGRAPHIC; LITHOGRAPHY; STEPPER

To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to 3D imaging is restricted by trade-off between focus depth and resolution. Advanced, cost-efficient solutions to fabricate wafer-scale 3D components are required. HoLiSTEP unleashes the potential of sub-wavelength Holographic Lithography (HL) as a powerful and enabling disruptive lithography. HL will overcome limitations of PL and facilitate production of novel 3D topographies with high resolution while making the production of high resolution IC much more affordable. An industrial prototype operating at 345nm with 200nm resolution will be produced and validated in an operational environment. Several advancements in holographic stepper subcomponents must be realised: A UV fibre-based laser with 20W output power at 345nm and 1.5m coherence length, an alignment system with 25nm overlay precision, an adaptive optical system with correction precision of 1/20? and software modules for vector diffraction models. Energy consumption of HL technology is drastically reduced compared to PL due to low power-consumption of the laser and production of complex structures in one exposure. HL images are not sensitive to mask defects, eliminating frequent mask replacements and use of toxic materials. Moreover, holographic masks act as projection optics, eliminating the need for complex optical systems. The HL prototype will be verified for 3D patterning for MEMS, MOEMS and micro-optical components to show better resolution, flexibility of 3D printing and reduced cost. HoLiSTEP will empower a positive transformative effect on environment, economy and society by enabling a wider range of companies to produce novel high-resolution 2D and 3D images at lower costs.

为了实现电路元件不断缩小的尺寸和更高的分辨率，投影光刻 (PL) 的复杂性和制造商的成本不断增加。它仅限于在平面上生成 2D 图像。 3D 成像的扩展受到焦深和分辨率之间的权衡的限制。需要先进、经济高效的解决方案来制造晶圆级 3D 组件。 HoLiSTEP 释放了亚波长全息光刻 (HL) 作为一种强大且具有颠覆性的光刻技术的潜力。 HL 将克服 PL 的局限性，促进高分辨率新型 3D 拓扑的生产，同时使高分辨率 IC 的生产变得更加经济实惠。将在操作环境中生产并验证在 345nm 下运行、分辨率为 200nm 的工业原型。全息步进子组件必须实现多项进步：在 345nm 和 1.5m 相干长度下输出功率为 20W 的 UV 光纤激光器、具有 25nm 重叠精度的对准系统、校正精度为 1/20? 的自适应光学系统。以及矢量衍射模型的软件模块。与 PL 相比，HL 技术的能耗大幅降低，因为激光器的功耗较低，并且一次曝光即可生成复杂的结构。 HL 图像对掩模缺陷不敏感，无需频繁更换掩模和使用有毒材料。此外，全息掩模充当投影光学器件，无需复杂的光学系统。 HL 原型将针对 MEMS、MOEMS 和微光学组件的 3D 图案进行验证，以显示更好的分辨率、3D 打印的灵活性和更低的成本。 HoLiSTEP 将使更多公司能够以更低的成本生产新颖的高分辨率 2D 和 3D 图像，从而对环境、经济和社会产生积极的变革影响。