SUB-WAVELENGTH HOLOGRAPHIC LITHOGRAPHY STEPPER FOR INTEGRATED CIRCUIT PRODUCTION (HoliSTEP)

用于集成电路生产的亚波长全息光刻步进机 (HoliSTEP)

• 批准号: 10102121
• 金额: $ 29.41万
• 依托单位: MODUS RESEARCH AND INNOVATION LIMITED
• 依托单位国家: 英国
• 项目类别: EU-Funded
• 财政年份: 2024
• 资助国家: 英国
• 起止时间: 2024 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=10102121
• 关键词: SUB; WAVELENGTH; HOLOGRAPHIC; LITHOGRAPHY; STEPPER

To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to 3D imaging is restricted by trade-off between focus depth and resolution. Advanced, cost-efficient solutions to fabricate wafer-scale 3D components are required. HoLiSTEP unleashes the potential of sub-wavelength Holographic Lithography (HL) as a powerful and enabling disruptive lithography. HL will overcome limitations of PL and facilitate production of novel 3D topographies with high resolution while making the production of high resolution IC much more affordable. An industrial prototype operating at 345nm with 200nm resolution will be produced and validated in an operational environment. Several advancements in holographic stepper subcomponents must be realised: A UV fibre-based laser with 20W output power at 345nm and 1.5m coherence length, an alignment system with 25nm overlay precision, an adaptive optical system with correction precision of 1/20? and software modules for vector diffraction models. Energy consumption of HL technology is drastically reduced compared to PL due to low power-consumption of the laser and production of complex structures in one exposure. HL images are not sensitive to mask defects, eliminating frequent mask replacements and use of toxic materials. Moreover, holographic masks act as projection optics, eliminating the need for complex optical systems. The HL prototype will be verified for 3D patterning for MEMS, MOEMS and micro-optical components to show better resolution, flexibility of 3D printing and reduced cost. HoLiSTEP will empower a positive transformative effect on environment, economy and society by enabling a wider range of companies to produce novel high-resolution 2D and 3D images at lower costs.

为了达到缩小的尺寸和电路元素的更高分辨率，投影光刻（PL）的复杂性和成本增长了。它仅限于在平面表面上产生2D图像。扩展到3D成像受重点深度和分辨率之间的权衡限制。需要先进，成本效益的解决方案来制造晶圆尺度3D组件。 Holistep释放了亚波型全息光刻（HL）的潜力，这是一种强大而有能力的破坏性光刻。 HL将克服PL的局限性，并促进具有高分辨率的新型3D地形，同时使高分辨率IC的产生更加负担得起。将在运营环境中生产和验证以200nm分辨率运行的工业原型。必须实现全息步进子组件的几个进步：一个基于紫外光纤的激光器，在345nm和1.5m的相干长度，一个具有25nm覆盖精度的对齐系统，一种自适应光学系统，校正精度为1/20？和矢量衍射模型的软件模块。与PL相比，HL技术的能源消耗大幅度降低了，这是由于激光器的功率低以及一次暴露中的复杂结构的产生。 HL图像对面膜缺陷不敏感，消除了频繁的面膜替换和使用有毒材料的使用。此外，全息掩模充当投影光学，消除了对复杂光学系统的需求。 HL原型将用于MEM，MOEM和微光学组件的3D图案，以显示更好的分辨率，3D打印的灵活性和降低的成本。 Holistep将通过使更广泛的公司以较低的成本生产新型的高分辨率2D和3D图像来对环境，经济和社会产生积极的变革作用。