GRASP - GREEN AGILE SEMICONDUCTOR PRODUCTION

GRASP - 绿色敏捷半导体生产

• 批准号: 10099437
• 金额: $ 120.33万
• 依托单位: PRAGMATIC SEMICONDUCTOR LIMITED
• 依托单位国家: 英国
• 项目类别: EU-Funded
• 财政年份: 2024
• 资助国家: 英国
• 起止时间: 2024 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=10099437
• 关键词: GRASP; GREEN; AGILE; SEMICONDUCTOR; PRODUCTION

Flexible Electronics has been one of the fastest developing technologies in recent decades. The traditional path is electronic components such as silicon chips (e.g., microcontrollers) integrated onto flexible substrates called “hybrid integration” or “flexible hybrid electronics” in integrated smart systems. We believe that this approach is not a viable long-term solution for future high-volume, low-cost and conformable integrated smart systems. Our vision is an integrated smart system that is built with only flexible electronic components including analogue circuitry, digital logic and memories. We call such a system a “Natively Flexible Integrated Smart System” or NFISS. NFISSes will enable new products in the Fast Moving Consumer Goods and healthcare wearables that have not been possible before because conventional silicon chips are too costly, too bulky and not conformable. The project will develop a flexible microcontroller unit (FlexMCU), which is the key component missing to enable NFISSes. The FlexMCU must be a low-power chip integrating a variety of functionality to address the functional requirements of the applications in FMCG and healthcare wearables. A novel hybrid complementary low-power thin-film transistor technology (100x per-transistor power reduction) will be developed to fabricate the FlexMCU in a sustainable flexible chip fab with 100-1000x less environmental footprint. The FlexMCU design is tailored to a specific domain composed of an open-source RISC-V based processor with built-in security features, an analogue frontend, on-chip memory and other peripherals. Then, the FlexMCU will be assembled using novel assembly and bonding methods onto a flexible film, which is, in turn, integrated onto a flexible substrate along with other flexible electronic components to build the first proof-of-concept NFISS thatwill be validated on two healthcare wearable applications.

柔性电子技术是近几十年来发展最快的技术之一，传统的途径是将硅芯片（例如微控制器）等电子元件集成到集成智能系统中的柔性基板上，称为“混合集成”或“柔性混合电子技术”。我们相信，这种方法对于未来大批量、低成本和一致性的集成智能系统来说并不是一个可行的长期解决方案，我们的愿景是仅使用包括模拟电路、数字逻辑和电子器件在内的灵活电子元件构建集成智能系统。我们将这样的系统称为“原生灵活的集成智能系统”或 NFISS，它将在快速消费品和医疗保健可穿戴设备中实现新产品，而这在以前是不可能的，因为传统的硅芯片成本太高、体积太大且不易实现。该项目将开发一种灵活的微控制器单元（FlexMCU），这是实现 NFISS 所缺少的关键组件。FlexMCU 必须是集成多种功能的低功耗芯片，以满足 NFISS 的功能要求。将开发一种新型混合互补低功耗薄膜晶体管技术（每个晶体管功耗降低 100 倍），以在可持续的柔性芯片工厂中制造 FlexMCU，从而减少 100-1000 倍的环境足迹。该设计是针对特定领域量身定制的，由具有内置安全功能的基于开源 RISC-V 的处理器、模拟前端、片上存储器和其他外设组成。 FlexMCU 将使用新颖的组装和粘合方法组装到柔性薄膜上，然后将其与其他柔性电子元件一起集成到柔性基板上，以构建第一个概念验证 NFISS，并将在两个医疗保健可穿戴应用中进行验证。