Nano-mechanical investigation of the effects of mechanical strain on semiconductor devices
机械应变对半导体器件影响的纳米力学研究
基本信息
- 批准号:23656083
- 负责人:
- 金额:$ 2.58万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Challenging Exploratory Research
- 财政年份:2011
- 资助国家:日本
- 起止时间:2011 至 2013
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
This study discusses a numerical model for analyzing the effects of mechanical stress on semiconductor devices. In other words, drift-diffusion device simulation is conducted using a physical model incorporating the effects of mechanical stress. Then, each impact of the stress-induced physical phenomena is analyzed. In our previous study, three physical phenomena that were attributed to mechanical stress have been modeled in our electron mobility model, i.e., the changes in relative population, the momentum relaxation time and the effective mass of electrons in conduction-band valleys. In this study, the stress-induced change of intrinsic carrier density is modeled. Stress-induce variations of drain current characteristics on nMOSFETs are evaluated using a drift-diffusion device simulator including above mentioned physical models. It is demonstrated that the impact of stress-induced change of intrinsic carrier density is small for our evaluated nMOSFETs.
本研究讨论了用于分析机械应力对半导体器件影响的数值模型。换句话说,漂移扩散装置模拟是使用包含机械应力影响的物理模型进行的。然后,分析压力引起的物理现象的每种影响。在我们之前的研究中,我们的电子迁移率模型模拟了归因于机械应力的三种物理现象,即相对布居数的变化、动量弛豫时间和导带谷中电子的有效质量。在这项研究中,对应力引起的本征载流子密度变化进行了建模。使用包括上述物理模型的漂移扩散器件模拟器来评估 nMOSFET 上漏极电流特性的应力引起的变化。结果表明,对于我们评估的 nMOSFET,应力引起的本征载流子密度变化的影响很小。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Hygromechanical analysis of liquid crystal display panels, Journal of Electronic Packaging
液晶显示面板的湿度机械分析,电子封装杂志
- DOI:
- 发表时间:2013
- 期刊:
- 影响因子:0
- 作者:Toru Ikeda; Tomonori Mizutani; Kiyoshi Miyake; Noriyuki Miyazaki
- 通讯作者:Noriyuki Miyazaki
Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM
通过数字图像与 SEM 的关联改进了 3D SIC 封装的非线性 FEA
- DOI:
- 发表时间:2013
- 期刊:
- 影响因子:0
- 作者:Toru IKEDA; Masatoshi OKA; Noriyuki MIYAZAKI; Kenji MATSUMOTO; Sayuri KOHARA; Yasumitsu ORII; Fumiaki YAMADA;Morihiro KADA
- 通讯作者:Morihiro KADA
ドリフト拡散デバイスシミュレーションを用いた1軸負荷に起因するnMOSFET の電気特性変動評価手法
利用漂移扩散器件模拟评估单轴加载引起的nMOSFET电特性波动的方法
- DOI:
- 发表时间:2012
- 期刊:
- 影响因子:0
- 作者:小金丸正明; 多田直弘; 池田徹; 宮崎則幸; 友景肇
- 通讯作者:友景肇
Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stess on n-Type Silicon Semiconductor
用于评估面内双轴机械应力对 n 型硅半导体影响的器件仿真
- DOI:
- 发表时间:2011
- 期刊:
- 影响因子:3.1
- 作者:Masaaki Koganemaru; Keisuke Yoshida; Toru Ikeda; Noriyuki Miyazaki;Hajime Tomokage
- 通讯作者:Hajime Tomokage
Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEM
结合 SEM-DIC 和 FEM 对 3D SIC 封装进行可靠性评估
- DOI:
- 发表时间:2013
- 期刊:
- 影响因子:0
- 作者:Toru Ikeda; Masatoshi Oka;Noriyuki Miyazaki
- 通讯作者:Noriyuki Miyazaki
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IKEDA Toru其他文献
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{{ truncateString('IKEDA Toru', 18)}}的其他基金
Symmetries of spatial graphs by 3-manifold topology
三流形拓扑空间图的对称性
- 批准号:
16K05163 - 财政年份:2016
- 资助金额:
$ 2.58万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Reliability Design of Conductive Adhesive Connection in Electronic Packages
电子封装中导电胶连接的可靠性设计
- 批准号:
14550082 - 财政年份:2002
- 资助金额:
$ 2.58万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Stress Intensity Factor Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal Stress
热应力下各向异性异种材料界面裂纹的应力强度因子分析
- 批准号:
12650091 - 财政年份:2000
- 资助金额:
$ 2.58万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
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