Effect of miniaturization of solder joint for electronics packagingon interfacial reaction between solder and substrate and impact reliability of the joint

电子封装焊点小型化对焊料与基板界面反应的影响及对焊点可靠性的影响

• 批准号: 22560721
• 负责人: NISHIKAWA Hiroshi
• 金额: $ 2.83万
• 依托单位: Osaka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2010
• 资助国家: 日本
• 起止时间: 2010 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-22560721/
• 关键词: エレクトニクス実装; 微細接合; 微細化; 鉛フリーはんだ; レーザ加熱; 高速せん断試験; 界面反応層; はんだ付け; 耐衝撃性; 高信頼性; 界面反応

As solder bumps become increasingly miniaturized to meet the severdemands of future electronic packaging, it is important to consider whether the solderjoint size and geometry could become reliability issues and thereby affect implementationof the Pb-free solders. In this study, the effect of the solder bump size on the interfacialreaction between the solder and a substrate and the impact reliability using a miniatureimpact tester was investigated. Experimental results suggest that the solder bump sizecan influence the interfacial reaction and the impact reliability of the solder bump.

随着焊料的颠簸变得越来越小的小型化，以满足未来电子包装的塞申请，重要的是要考虑焊接连接尺寸和几何形状是否可能成为可靠​​性问题，从而影响无PB焊料的实现。在这项研究中，研究了焊料大小对焊料与底物之间的互反性以及使用微型Impact测试仪的影响可靠性的影响。实验结果表明，焊料凸起sizecan会影响界面反应和焊料撞击的影响。

项目成果

Intermetallic Compound Formation andGrowth at the Lead-Free Solder/CuInterface during Laser Reflow Solderingand during Isothermal Aging

激光回流焊接和等温老化过程中无铅焊料/铜界面金属间化合物的形成和生长

• 发表时间: 2012
• 作者: H. Nishikawa;N. Iwata and T. Takemoto
• 通讯作者: N. Iwata and T. Takemoto

低融点はんだ/Cu 継手の耐落下衝撃性評価

低熔点焊料/铜接头的跌落冲击性能评估

• 发表时间: 2011
• 作者: 山本晃将;西川 宏
• 通讯作者: 西川 宏

低融点はんだ/Cu継手の耐落下衝撃性評価

低熔点焊料/铜接头的跌落冲击性能评估

• 发表时间: 2011
• 作者: 山本晃将;西川 宏;山本晃将
• 通讯作者: 山本晃将

Impact reliability ofmicro-joints soldered with Sn-Ag-Cusolder using laser process

激光工艺锡银铜焊料焊接微接头的冲击可靠性

• 发表时间: 2011
• 作者: H. Nishikawa;N. Iwata and T. Takemoto;表面技術協会表面技術環境部会編;H. Nishikawa
• 通讯作者: H. Nishikawa