Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation Behavior

通过监测应力松弛行为改进电子封装压痕蠕变方法

• 批准号: 22560070
• 负责人: OHGUCHI Ken-ichi
• 金额: $ 2.83万
• 依托单位: Akita University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2010
• 资助国家: 日本
• 起止时间: 2010 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-22560070/
• 关键词: 応力緩和; インデンテーション; クリープ; 電子実装基板

The indentation creep test is expected to be put into practical use for evaluating the strength reliability of electronic packages. However, there is a problem that the creep law derived by the test does not correspond to that derived by tensile creep tests. This study showed that this problem was caused by the definition of the reference area for calculating the stress in the indentation test. Based on this fact, a new reference area for indentation tests and a new indentation test method which evaluates creep characteristics by monitoring stress relaxation behavior were proposed.

压痕蠕变试验有望投入实际应用，用于评估电子封装的强度可靠性。然而，存在一个问题，即该试验得出的蠕变规律与拉伸蠕变试验得出的蠕变规律并不对应。本研究表明，这个问题是由压痕试验中计算应力的参考区域的定义引起的。基于这一事实，提出了压痕试验的新参考区域和通过监测应力松弛行为来评估蠕变特性的新压痕试验方法。

项目成果

圧子押込み・深さ保持によるはんだのクリープ特性評価法の提案

使用压头压痕和深度保持的焊料蠕变特性评价方法的提案

• 发表时间: 2012
• 作者: 瀧田敦子;大口健一;佐々木克彦
• 通讯作者: 佐々木克彦

A New Reference Area for Indentation Creep Tests to Obtain Real Steady Creep Strain of Solder Alloy

压痕蠕变试验的新参考区域以获得焊料合金的真实稳态蠕变应变

• 发表时间: 2013
• 作者: Atsuko Takita;Katsuhiko Sasaki;and Ken-ichi Ohguchi
• 通讯作者: and Ken-ichi Ohguchi