Development of double side surface ultra-smoothness polishing technique by means of gearless workpiece rotation method based on new concept

基于新理念的无齿轮工件旋转法双面超光滑抛光技术的开发

• 批准号: 17360065
• 负责人: YASUI Heiji
• 金额: $ 9.79万
• 依托单位: Kumamoto University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2005
• 资助国家: 日本
• 起止时间: 2005 至 2006
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-17360065/
• 关键词: double surface polishing; high removal rate; ultra-high pressure; ultra-high speed; new method; gearless workpiece rotation; polisher; magnetic disk substrate

Using ultra-high polishing pressure and polishing speed, this research aims to develop the double side surface polishing method of ultra-high removal rate for various kinds of workpieces such as magnet disk substrate, silicon wafer and so on. The new type of double side surface polishing machine based on new concept is manufactured on trial. In the machine, the workpiece is rotated by the couple of the friction forces in the reverse directions to each other, which are caused from the contact between workpiece and upper or lower polishing plate. That is, in the rotation mechanism of workpiece, the gear is not used. On the contrary, in the conventional polishing machine, the rotation of workpiece is done with the gear cut on the outside circle of carrier holding the disk substrate. Furthermore the double side surface polishing characteristics in the conditions of ultra-high polishing pressure and polishing speed using the new type of machine is examined. The summary is as follows ;1) Imp … More rovement of polishing machine(1) Establishment of stable rotation technique of workpieceFirst of all, the couple of friction forces is caused by stepping the polishing plate. In the method, to machine the plate the precise seep is difficult. And also the stable rotation of workpiece is obtained difficult. To resolve the problem, the new technique in which the contact friction force between the workpiece and polisher is changed by holing a part of the polisher (surface is developed. Using the method, the stable rotation of workpiece is done.(2) Development of cooling system of polisherIn the polishing conditions of ultra-high pressure and speed, large polishing heat occurs. Due to the heat, polisher surface is damaged. To solve the problem, the cooling systems of polishing plate are developed. The method is useful for the remove of generated heat.(3) Investigation of dynamic pressure on polishing characteristicsIn the condition ultra-high polishing speed, large buoyancy is found to reduce polishing pressure. On the basis of the result, the relationship between removal rate and polishing condition is cleared experimentally.2) Development of linear type of double surface polishing machineA linear type of double surface polishing machine in which the workpiece is rotated by the couple of friction forces as mentioned above for the rotary type of new double surface polishing machine is manufactured on trial. The machine is ascertained possible to perform the effective polishing operation.3) Investigation of polishing characteristics using the new type of double side surface polishing machineTo clear the polishing characteristics using the new type of polishing machine, the experiment is carried out by the various kinds of polishing conditions. The influence of polishing conditions on the removal rate and smoothness is cleared experimentally. Less

该研究使用超高的抛光压力和抛光速度，旨在为各种工件（例如磁铁磁盘底物，硅Waver等）开发双侧表面抛光方法的超高去除速率。基于新概念的新型双侧面抛光机是在试验中制造的。在机器中，工件是由相反方向的两对摩擦力旋转的，这是由工作场所和上或下抛光板之间的接触引起的。也就是说，在工作场所的旋转机理中，不使用齿轮。相反，在常规的抛光机中，工作场所的旋转是在载有磁盘基板的载体外圈上切割的。此外，还检查了使用新型机器的超高抛光压力和抛光速度的双侧表面抛光特性。摘要如下。 ; 1）Imp…更多的抛光机器人（1）建立了所有工件限制的稳定旋转技术，这对摩擦力的摩擦力是由踩踏板造成的。在该方法中，要加工板，精确的渗漏很困难。而且很难获得工件的稳定旋转。为了解决问题，通过孔的一部分抛光器（开发了表面的一部分。使用该方法，进行工件的稳定旋转。（2）抛光剂的抛光系统的开发，超高压力和速度的抛光条件，大量的抛光热量是抛光剂，抛光剂溶解了抛光剂。该方法对于去除产生的热量很有用。（3）在条件上对抛光特性进行动态压力的研究，发现大量浮力可降低抛光压力。旋转类型的新双层抛光机是在试验中制造的。可以确定该机器可以执行有效的抛光操作。3）使用新型的双侧表面抛光机械调查抛光特性，使用新型的抛光机清除了抛光特性，该实验是由各种抛光条件进行的。抛光条件对去除速率和平滑度的影响将通过实验清除。较少的

项目成果

Possibility of Ultra-Ultra High Pressure Polishing of Magnetic Disk Substrate

磁盘基板超超高压抛光的可能性

• 发表时间: 2006
• 期刊: Proc. 6th International Conference and 10th annual general meeting of the european society for precision engineering and nanotechnology
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Takuya NIKI
• 通讯作者: Takuya NIKI

Polisher Life in Ultra-High Pressure and Ultra-High Speed Polishing of NiP Plated Aluminum Magnetic Disk Substrate

镀NiP铝磁盘基板超高压超高速抛光的抛光机寿命

• 发表时间: 2005
• 期刊: Proc. ASPE 20th Annual Meeting
• 作者: Heiji YASUI;Yutaka YAMASAKI;Kanta YAMAGUCHI;Seiji MATSUKAWA;Shoji KURIBAYASHI;Takuya NIKI
• 通讯作者: Takuya NIKI

アルミ磁気ディスク基板の超高圧力・超高速度ポリシングにおけるポリシャ寿命の検討(第1報)- -層ナップ構造ポリシャの場合 -

铝磁盘基板超高压超高速抛光中抛光机寿命的检验（第一篇报告） - - 层状毛刺结构抛光机案例 -

• 发表时间: 2007
• 期刊: 精密工学会誌 Vol. 73・No. 1
• 作者: 安井平司;山口寛太;松川誠治;山崎穣
• 通讯作者: 山崎穣

Polisher Life in Ultra-smoothness Polishing of Magnetic Disk Substrate Using New Double Side Surface Polishing Machine

使用新型双面抛光机对磁盘基板进行超光滑抛光时的抛光机寿命

• 发表时间: 2006
• 期刊: Proc. ASPE 21 Annual Meeting
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Takuya NIKI;Shingo OTSUKA;Tomohiko NAGATA;Hisaaki KUBOTA
• 通讯作者: Hisaaki KUBOTA

Development of Gearless Polishing Machine for High Removal Rate and Ultra-Smoothness Double Side Surface Polishing

高去除率超光滑双面抛光无齿轮抛光机的开发

• 发表时间: 2005
• 期刊: Proc. Euspen International Conference
• 作者: Heiji YASUI;Kanta YAMAGUCHI;Shouji KURIBAYASHI
• 通讯作者: Shouji KURIBAYASHI