Comprehensive study on material behaviors in nanometer machining of brittle materials and its applications

脆性材料纳米加工材料行为综合研究及其应用

基本信息

批准号：
06302035
负责人：
SATA Toshio
金额：
$ 12.99万
依托单位：
Toyota Technological Institute
依托单位国家：
日本
项目类别：
Grant-in-Aid for Co-operative Research (A)
财政年份：
1994
资助国家：
日本
起止时间：
1994 至 1995
项目状态：
已结题

项目摘要

To understand the mechanisms of ductile mode material removal at small depth of cut and the transition in material removal from brittle to ductile in machining of brittle materials, experimental studies on micromachining of various brittle materials and molecular dynamics (MD) computer simulations on microcutting of defect free monocrystalline silicon are carried out.Mophological observations of worksurfaces machined by diamond turning and ELID griding under various machining conditions by optical microscope, SEM and AFM show that any brittle material, regardless of their intrinsic brittleness, can be machined in pure ductile mode under a sufficiently small size of unit process (corresponding to uncut chip thickness in turning, grain depth of cut in grinding). Usefulness of microindentation testing and single point scratch testing with continuously increasing of depth of cut is demonstrated for the evaluation of intrinsic brittleness or ductility and critical size of unit process for d … More uctile mode machining of individual materials.MD simulations suggest that the critical depth of cut can be governed by the amount of energy of elastic waves generated in cutting zone as the results of release of potential energy stored in workpiece by the plowing of cutting edge. "Renormalized MD" simulation, in which the concept of "renormalization" is combined with conventional MD simulation, is proposed so that MD can be applied to various size of unit proces ranging from nanometer to micrometer scale. The results of renormalized MD simulations on microcutting of silicon under the uncut chip thickness from 1 nm to 1 mm show that chip removal is performed in ductile mode even at 1 mm uncut chip thickness. However, by incorporating the effect of chemical adsorption of atomospheric gas and/or liquid on cutting tool and workpiece, which was not considered in conventional MD simulation, the brittle-ductile transition phenomena can be observed. The result suggests that there must be some additional mechanism such as chemical adsorption of atomospheric gas and/or liquid in brittle-ductile transition in material removal process of brite materials. Less

要了解在脆弱的材料机械中，从脆性到易延展的材料切除到材料的过渡时，延性模式模式的机制去除，对各种脆性材料的微加工和分子动力学（MD）计算机模拟的微加工研究的实验性研究，对各种单机械硅的微层含量，以及diaoction cornical and corried and corried。通过光学显微镜，SEM和AFM进行加工条件，表明，无论其内在的脆性如何，任何脆性材料都可以在足够小的单位过程（对应于未切开的芯片厚度，磨碎中的谷物深度）下以纯延展模式进行加工。表明，微观定位测试和单点刮擦测试的有用性随着剪切深度的连续增加而被证明，以评估固有的勃起性或延展性或延性和临界单位过程的D…更加插入的单个材料的加工。MD模拟的更加效率模式的加工。MD模拟的临界深度可以通过在切割范围内的弹性范围进行启动的能量的临界深度来控制弹性范围的弹性范围，从而释放了切割区域的弹性范围。提出了“重新归一化的MD”模拟，其中“重新归一化”的概念与常规MD仿真相结合，以便将MD应用于从纳米到千分尺尺度的各种单位过程中。从1 nm到1 mm的未切割的芯片厚度下对硅的小重新定位的重新量化的MD模拟的结果表明，即使在1 mm未切开的芯片厚度下，芯片去除也是在延展性模式下进行的。但是，通过纳入原子球气体和/或液体对切割工具和工作场所的化学添加作用（在常规MD模拟中未考虑），可以观察到脆性延性过渡现象。结果表明，必须在易碎的延性过渡过程中，在brite材料的材料去除过程中，必须有一些其他机制，例如化学物质增加了阳光球气和/或液体。较少的