Integration technologies for immersion cooling in microelectronics

微电子领域浸入式冷却集成技术

• 批准号: 513262-2017
• 负责人: Sylvestre, Julien
• 金额: $ 18.58万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2020
• 资助国家: 加拿大
• 起止时间: 2020-01-01 至 2021-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=696844
• 关键词: Integration; technologies; immersion; cooling; microelectronics

The proposed project is a research collaboration between the Université de Sherbrooke (UdeS), Systemex Energy inc. and Varitron Technologies inc., to develop a new type of highly efficient cooling technology for advanced electronic devices. This cooling technology is based on immersing the semiconductor device into a dielectric liquid, to benefit from its vaporization phase change to carry heat away from the device efficiently. This approach has been studied before, in relatively simple implementations which clearly demonstrates its impressive thermal performances. However, immersion cooling has not yet reached its full potential because of two technological issues, both related to an incomplete scientific understanding of the phenomena involved in immersion cooling. The first issue is the so-called boiling crisis, a complex phenomenon involving the flux of heat, liquid and vapor which limits the thermal performances and create stability issues. The second issue is the reliability risk created by immersing electronic components which have not been designed for this purpose, and which might be subjected to new failure mechanisms because of immersion. Here, we propose to study at a fundamental level both the boiling crisis and the reliability risk, to develop precisely engineered immersion hardware which can be rigorously shown to be efficient, stable and reliable. The project will used advanced experimental techniques and simulation methods to contribute to the scientific understanding of cooling by boiling. The cooling technology will be developed and tested on industrial-scale manufacturing equipment at C2MI, so it can be produced cost-effectively in a well integrated packaging process, with an eventual expedited transfer of the new technology to the industry. The kinetics of failure mechanisms will be measured experimentally, and will be interpreted with respect to chemical interactions and thermomechanical phenomena in the immersed hardware.

拟议的项目是舍布鲁克大学 (UdeS)、Systemex Energy Inc. 和 Varitron Technologies Inc. 之间的一项研究合作，旨在为先进电子设备开发一种新型高效冷却技术。器件进入电介质液体中，以利用其汽化相变来有效地将热量从器件中带走，这种方法之前已经在相对简单的实施中进行过研究，这清楚地证明了其令人印象深刻的热性能。由于两个技术问题而充分发挥了其潜力，这两个技术问题都与对浸没冷却现象的不完整的科学理解有关。第一个问题是所谓的沸腾危机，这是一种涉及热、液体和蒸汽通量的复杂现象，限制了这种现象。第二个问题是浸泡电子元件所带来的可靠性风险，这些电子元件不是为此目的而设计的，并且可能会因为浸泡而遭受新的故障机制。基本层面的沸腾危机和可靠性该项目将利用先进的实验技术和模拟方法来开发和测试沸腾冷却技术，以开发精确设计的浸入式硬件。在 C2MI 的工业规模制造设备上，因此可以在良好集成的封装工艺中经济高效地生产，并最终加快新技术向行业的转移。将通过实验测量失效机制的动力学。解释为关于浸入式硬件中的化学相互作用和热机械现象。