Development of the thermal design approach for electronic equipment incorporated with electric design and CFD software.

开发结合电气设计和 CFD 软件的电子设备热设计方法。

基本信息

批准号：
16560190
负责人：
ISHIZUKA Masaru
金额：
$ 1.34万
依托单位：
Toyama Prefectural University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2004
资助国家：
日本
起止时间：
2004 至 2005
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16560190/
关键词：
computational fluid dynamics (CFD)thermal design switch mode power supply incorporation with electric design and thermaldesign modeling of components estimation of amount of dissipated heat 電子機器の熱設計電機設計との統合熱流体シミュレーションパワー半導体

项目摘要

In the design process of electronic equipments early estimates of component temperatures are of great importance. Many tools exist to assist thermal design engineers during this process, including flow network modeling (FNM), computational fluid dynamics (CFD), and well-established heat transfer correlations, and the thermal flow simulation technique is applied to thermal design in the development phase of electronic equipment.In many electronic equipment, several coil components, such as a transformer and a high-frequency inductor are used and it is a one of the most important component for thermal design. Therefore, in order to improve the accuracy of thermal flow simulation, the coil component needs to be accurately analyzed together with the other components within a single numerical model. However, regarding the system-level thermal simulation, there are few reports in which the detail of modeling method for coil component is documented. The purpose of this study is to develop the … More compact thermal modeling method of coil component applicable to the system-level thermal flow simulation. This study especially focused on high-frequency inductor as the coil component.In the proposed modeling method, the effect of proximity-effect loss occurs near the air gap on winding surface temperature was considered. Additionally, the effect of anisotropic thermal conductivity in a winding block on the winding surface temperature was considered. In this study the first step is the measurement of the winding surface temperature distribution of an experimental dummy inductor that imitates proximity loss occurring locally near an air gap in order to confirm the influence of proximity loss on the winding surface temperature distribution. Next, we conducted a numerical simulation of the experimental dummy inductor winding surface temperature.As a key point in the numerical modeling, the significance of considering the influence of the proximity-effect loss and the anisotropic thermal conductivity on the winding surface temperature was demonstrated experimentally and numerically. Less

在电子设备的设计过程中，零件温度的早期估计非常重要。在此过程中，存在许多工具来协助热设计工程师，包括流动网络建模（FNM），计算流体动力学（CFD）和良好的传热相关性，并且在电子设备的开发阶段将热流仿真技术应用于热设计。在许多电子设备的开发阶段。在许多电子设备中，几个电子设备，几种盘旋组件，例如换乘型和高效率的组成部分，并且具有较高的效果。因此，为了提高热流仿真的准确性，需要将线圈组件与单个数值模型中的其他组件一起准确分析。但是，关于系统级的热模拟，很少有报道记录了线圈组件的建模方法的细节。这项研究的目的是开发……更紧凑的热建模方法的线圈组件，适用于系统级热流仿真。这项研究尤其集中于作为线圈组件的高频诱导的。在提出的建模方法中，考虑了近距效应损失在气隙附近对绕组表面温度的影响。此外，考虑了绕组块中各向异性导热率对绕组表面温度的影响。在这项研究中，第一步是测量实验虚拟电感器的绕组表面温度分布，该旋风效果模仿了局部在气隙附近发生的接近度损失，以确认接近度损失对绕组表面温度分布的影响。接下来，我们进行了实验性虚拟电感器绕组表面温度的数值模拟。作为数值建模的关键点，考虑到接近效应损耗的影响以及各向异性导热率对绕组表面温度的影响。较少的