RESEARCH ON THERMO-MICRO-MECHANICS OF COMOPSITE MATERIALS FOR ELECTRONIC DEVICE

电子器件复合材料热微力学研究

• 批准号: 03452106
• 负责人: KSHIKAWA Hiromasa
• 金额: $ 4.35万
• 依托单位: (FACULTY OF ENGINEERING) HOKKAIDO UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (B)
• 财政年份: 1991
• 资助国家: 日本
• 起止时间: 1991 至 1993
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-03452106/
• 关键词: Electronic Device; Sub-micro Structure; Rate Effect; 60Sn-40Pb Solder; Temperature Effect; viscoplastic Constitutive model; Thermal Fatigue; 3D FEM; 熱疲労; 60Sn-40Pb合金; 三次元有限要素法; 60Snー40Pb合金; 疲労寿命; 塑性ひずみエネルギ密度

(1) Mechanical properties required for electronic devices were investigated by the mechanical data of materials for electronic devices. As a result, it was found that solder joint (60 Sn - 40 Pb) is used nder most severe condition such as cyclic loading.(2) Strain rate effect and temperature effect of 60 Sn - 40 Pb solder depends on both strain rate and temperature. Moreover, a cnstitutive equation for viscoplasticity was constructed based on the constitutive model for cyclic plasticity previously proopsed by the head of investigator. The constitutive equation for viscoplasticity was verified to predict both the strain rate effect and temperature effect of 60Sn-40Pb solder.(3) Materials for electronic devices, especially solder joints, odccur fatigue failure caused by cyclic loading. Then, a method to predict fatigue failure of 60Sn-40Pb was constructed using the concept of the plastic strain energy density and the proposed constitutive equation.(4) Mechanical properties of 60Sn-40Pb solder at several temperature were observed in detail to clear the effect of residual stress induced by phase transformation. As a result, the possibility ot predict the effect of phase transformation of 60Sn-40Pb solder by modifying the proposed model considering the kinematic strain aging.(5) Three dimension finite element analysis was conducted for optimization of electronic devises using the proposed constitutive equation. As a result, it was found out that both stress distribution an deformation of the actual electronic devices was predicted using the proposed constitutive equation for viscoplasticity.

（1）通过电子设备的材料的机械数据研究了电子设备所需的机械性能。结果，发现使用了最严重的焊接接头（60 sn -40 pb），例如循环加载。（2）60 sn -40 pb焊料的应变速率效应和温度效应取决于应变率和温度。此外，基于调查员头部先前主张的循环可塑性的组成型模型，构建了粘膜塑性的方程。验证了粘塑性的组成型方程，以预测60sn-40pb焊料的应变速率效应和温度效应。（3）电子设备（尤其是焊接接头）的材料，由循环载荷引起的odccur疲劳故障。然后，使用塑性应变能密度和提出的本构方程的概念构建了一种预测60sn-40pb的疲劳失败的方法。（4）在几个温度下在几个温度下焊接60sn-40pb的机械性能，以清除通过相变诱导的残基应力的效果。结果，IT的可能性通过修改运动型应变老化的建议模型来预测60sn-40pb焊料的相变作用。结果，发现两种应力分布都使用拟议的构成方程来预测实际电子设备的变形，以实现粘性性。

项目成果

M.Kobayashi: "Ultrasonic Evaluatin of Microstructual Changes of Solid Materials under Plastic Deformation" ASME, Characterization of Mechanical Properties of materials. Vol. 33. pp. 33-46 (1992)

M.Kobayashi：“塑性变形下固体材料微观结构变化的超声评估”ASME，材料机械性能的表征。

石川博將: "背応力の記憶項を考慮した繰返し塑性構成式" 日本機械学会論文集A編. 59. 360-366 (1993)

Hiromasa Ishikawa：“考虑背应力记忆项的重复塑性本构方程”，日本机械工程学会会刊，A 版，59. 360-366 (1993)。

"Life Prediction of 60Sn-40Pb Solder using Constitutive Equation for Cyclic Viscoplasticity" Proc. of JSME the 69th Anual meeting. Vol. 2. pp. 848-850 (1994)

“使用循环粘塑性本构方程预测 60Sn-40Pb 焊料的寿命”Proc。

K.Sasaki: "Constitutive Equation for Cyclic plasticity and Fatigue failure of 60Sn-40PB Solder" Proc. of JSME the 69th Annual Meeting. Vol. A. pp. 539-540 (1992)

K.Sasaki：“60Sn-40PB 焊料循环塑性和疲劳失效的本构方程”Proc。

"Prediction of fatigue failure of 60Sn-40Pb Solder using Constitutive Equation for Cyclic Viscoplasticity" Proc. of 1994 WAW Symposia on Material & Mechanics in Electronic packaging for 21th Century. (in press).

“使用循环粘塑性本构方程预测 60Sn-40Pb 焊料的疲劳失效”Proc。