SBIR Phase I: Innovative Solid-State Phase Change Cooling to Supercharge Central Processing Unit (CPU) Performance

SBIR 第一阶段：创新固态相变冷却，增强中央处理器 (CPU) 性能

• 批准号: 2322115
• 负责人: Asher Leff
• 金额: $ 27.5万
• 依托单位: TAUMAT LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-09-01 至 2024-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2322115&HistoricalAwards=false
• 关键词: SBIR; Phase; Innovative; Solid; State

The broader impact/commercial potential of this Small Business Innovation Research Phase I project aims to establish a new approach to high-performance central processing unit (CPU) thermal management that focuses on the development and application of innovative solid-solid thermal energy storage (TES) materials and hardware. Increasingly, steady-state cooling solutions are unable to keep up with the required operating frequencies and resulting thermal loads of temperature-sensitive computing and electronic components. As a result, these components are throttled down to reduce heating. This results in the desired temperature reduction but inevitably leads to clock speed and performance reductions as well. The proposed project aims to challenge this existing tradeoff and produce CPU heat sinks that can maintain 3X computational performance ‘sprints’ with no added weight/volume nor electrical energy expenditure, in a scalable and easily deployable, drop-in form factor. Fueled by a global demand for high-performance computing, internet-of-things, and handheld electronics, the market for high-performance CPU coolers is rising with a market size of about $2.04 billion and a compound annual growth rate of 3.73-4.64% over the next decade. The target solid-solid TES heatsink is transferable to battery fast charging, system-on-chip devices, and the power electronic market.The intellectual merit of this project resides in newly-identified thermal energy storage materials to shift the paradigm in CPU cooler design away from simply maximizing steady-state heat dissipation towards an optimized approach that combines high steady-state dissipation with high-capacity thermal storage. This Phase I project has three primary research objectives: i) develop analytical and numerical topology optimization approaches to identify ideal thermal energy storage material properties and composite heat transfer/capacity structures for CPU applications: ii) leverage data-driven shape memory alloy discovery using an artificial intelligence framework to identify and ultimately arc-melt new thermal energy storage materials that exhibit high-latent heat, high-conductivity, low hysteresis, and/or the ideal combination of material properties based on CPU requirements: and iii) design, fabricate, and test prototypes for model validation and concept demonstration. These technical efforts, combined with risk reduction and mitigation steps, and techno-economic and manufacturing analysis will enable leap-ahead improvements in an ever-expanding array of high-power, thermally limited applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个小型企业创新研究阶段I项目的更广泛的影响/商业潜力旨在建立一种新的方法，用于高性能中央加工单元（CPU）热管理，重点是开发和应用创新的固体固体热量存储（TES）材料和硬件。越来越多的稳态冷却解决方案无法跟上所需的工作频率，并导致温度敏感的计算和电子组件的热载荷。结果，这些组件被降低以减少加热。这会导致所需的温度降低，但不可避免地会导致时钟速度和性能降低。拟议的项目旨在挑战这种现有的权衡，并产生CPU散热器，这些散热器可以保持3倍的计算性能“冲刺”，而没有增加重量/体积/音量或电能消耗，也可以以可扩展且易于部署的液位形式为止。在全球对高性能计算，通讯和手持电子电子产品的需求推动下，高性能CPU冷却器的市场正在上升，在未来十年中，市场规模约为20.4亿美元，复合年增长率为3.73-4.64％。目标固体固体TES HEATINK被转移到电池快速充电，芯片上的系统和电力市场。在新识别的新识别的热量储能材料中，该项目住宅的智力优点将CPU冷却器中的范式转移到CPU冷却器中的范式中，从简单地将稳定的储存量最大化，将稳定的储存量最大化，将稳定的稳定性与稳态稳定性相结合。该阶段I项目具有三个主要的研究目标：i）开发分析和数值拓扑优化方法，以确定理想的热能储能材料和CPU应用的复合传热/容量结构：ii）利用数据驱动的数据驱动的形状 - 使用人工智能框架来发现并确定高级/高位的高位，高位，高位，高位，高位，高位，高位，高位，高位，并最终识别高型热量，高位，高位，并最终基于CPU要求的材料属性：和iii）设计，制造和测试原型用于模型验证和概念演示。这些技术努力，加上降低风险和缓解步骤，技术经济和制造分析将在不断扩展的一系列高功率，热有限的应用程序中进行跳跃改进。该奖项反映了NSF的法定任务，并通过使用该基金会的知识分子优点和广泛影响来评估NSF的法定任务，并被认为是珍贵的支持。