SBIR Phase II: Ultrasoft Thermal Interface Elastomer for Microelectronics

SBIR 第二阶段：微电子用超软热界面弹性体

• 批准号: 2233069
• 负责人: Navid Kazem
• 金额: $ 85.87万
• 依托单位: Arieca Inc.
• 依托单位国家: 美国
• 项目类别: Cooperative Agreement
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-04-15 至 2025-03-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2233069&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Ultrasoft; Thermal

The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase II project is in improving the efficiency and performance of electronic devices. Modern devices, including cell phones, laptops, and electric vehicles contain high-powered semiconductor components which generate unwanted heat that, in turn, reduces their efficiency. If left unchecked, this heat may destroy the devices and even injure users or cause damage to the environment. This project addresses excessing heating in electronic devices by introducing new high-performance thermal interface materials based upon embedding liquid metal droplets inside of stretchable polymers. These so-called liquid metal embedded elastomer (LMEE) materials can be applied to computer processors, graphics cards, advanced artificial intelligence (AI) chips, and even power modules in electric vehicles, to help keep electronic devices operating at peak performance at all times. The growing prevalence of the Internet of Things, 5G network infrastructure, and electric cars all necessitate better thermal solutions so that devices can function properly. This project could contribute to the semiconductor, automotive, and healthcare industries.This project’s goal is to develop and commercialize a thermal interface material (TIM) for packaged microelectronics, building upon the LMEE composite architecture. The technology will outperform existing TTIMs by combining the superior thermal resistance of metal-based solid TIMs (S-TIMs) with the mechanical reliability of polymer-based TIMs and the high-volume manufacturing compatibility of thermal greases. Specifically, LMEEs possess a unique combination of metal-like thermal resistance, rubber-like elasticity, and liquid emulsion-like rheology prior to curing, thereby solving two main challenges present with existing S-TIMs: (i) poor mechanical reliability over long durations and (ii) incompatibility with syringe-based dispensing for high volume manufacturing. The strategy proposed in this project is to synthesize an LMEE-based TIM that forms a robust bond between the surfaces of the semiconductor chip and surrounding enclosure, maintains a controlled thickness between the chip and enclosure, and ensures the necessary rheology for syringe-based dispensing. Specific project tasks build around a comprehensive technical plan that includes materials synthesis, performance characterization, and in-package evaluation. In parallel, the project will examine methods for storage, shipment, and dispensing to ensure a product that is ready for integrated device manufacturers and semiconductor assembly and testing industry by the end of this project.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该小型企业创新研究 (SBIR) 第二阶段项目的更广泛/商业影响在于提高电子设备的效率和性能，包括手机、笔记本电脑和电动汽车，这些设备包含高功率半导体元件，这些元件会产生不必要的热量。如果不加以控制，这种热量可能会损坏设备，甚至伤害用户或对环境造成损害。该项目通过引入基于嵌入的新型高性能热界面材料来解决电子设备中的过热问题。里面有液态金属滴这些所谓的液态金属嵌入弹性体（LMEE）材料可应用于计算机处理器、显卡、先进人工智能（AI）芯片，甚至电动汽车的电源模块，以帮助电子设备保持最佳运行状态。物联网、5G 网络基础设施和电动汽车的日益普及都需要更好的散热解决方案，以便该项目能够为半导体、汽车和医疗保健行业做出贡献。是为了基于 LMEE 复合架构，开发并商业化用于封装微电子的热界面材料 (TIM)，该技术将金属基固体 TIM (S-TIM) 的卓越耐热性与聚合物的机械可靠性相结合，从而超越现有的 TTIM。特别是，LMEE 具有类金属耐热性、类橡胶弹性和类液体乳液的独特组合。固化前的流变学，解决了现有 S-TIM 存在的两个主要挑战：(i) 长时间机械可靠性差，以及 (ii) 与大批量生产的注射器点胶不兼容。基于 LMEE 的 TIM 可在半导体芯片和周围外壳的表面之间形成牢固的粘合，保持芯片和外壳之间的受控厚度，并确保基于注射器的特定点胶所需的流变性。项目任务围绕综合技术计划构建，其中包括材料合成、性能表征和封装内评估，同时该项目将检查存储、运输和分配方法，以确保产品为集成设备制造商和半导体做好准备。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。