LEAPS-MPS: Solution Processed 2D Tellurene with Outstanding Thermoelectric Properties

LEAPS-MPS：具有出色热电性能的溶液处理二维碲烯

• 批准号: 2213441
• 负责人: Heng Wang
• 金额: $ 23.68万
• 依托单位: Illinois Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-07-01 至 2024-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2213441&HistoricalAwards=false
• 关键词: LEAPS; MPS; Solution; Processed; 2D; LEAPS; MPS; Solution; Processed; 2D

Non-technical Description. Providing precise, localized temperature control is important for many applications, such as to keep microprocessors from overheating and for medical equipment. This is often realized with thermoelectric devices where cooling and heating are performed by special semiconductors. Thermoelectric devices also have the potential for renewable energy, yet cost and efficiency limitations have precluded widespread use. While other semiconductor devices have seen dramatic increases in performance through materials advances, thermoelectric devices still use the same materials as decades ago. This project explores a new pathway to thermoelectrics, taking advantage of recent progress in low-dimensional materials and a novel synthesis technique. This research has the potential for profound impact in many technical areas. The research activities advance knowledge on the control of electrical and thermal transport in two-dimensional semiconductors as well as how to preserve the merit of these materials when they are assembled into bulk forms. The project promotes the education and training of next-generation workforce in semiconductor engineering. These include community-focused, in-person and virtual outreach programs, which serve primarily underprivileged groups on the south side of Chicago.Technical Description. This research project explores tellurene for thermoelectrics, based on a favorable electronic band structure in its two-dimensional form. A large number of degenerate bands is the key feature for better thermoelectric performance. This activity advances research on similar materials for thermoelectric and other applications. Ligand removal will be systematically studied to minimize interface influence on electrical transport. Carrier density tuning, a challenging problem for 2D semiconductors, will be addressed by a surface doping scheme.The use of inorganic binders allows mild-temperature assembly to preserve nanoscale features. Electrical and thermal transport property characterizations are complemented with Boltzmann transport modeling, which provides deep understanding on the unique features of tellurene. Knowledge generated through this research will provide insights on future materials design for thermoelectric and other device applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

非技术描述。提供精确的局部温度控制对于许多应用非常重要，例如防止微处理器过热和医疗设备。这通常是用热电设备实现的，在这些设备中，特殊半导体进行冷却和加热。热电设备还具有可再生能源的潜力，但成本和效率的限制已排除在广泛使用。尽管其他半导体设备通过材料的进步看到了性能的急剧提高，但热电设备仍然使用与几十年前相同的材料。该项目探索了一种新的热电学途径，利用了低维材料和新型合成技术的最新进展。这项研究有可能在许多技术领域产生深远影响。研究活动提高了有关控制二维半导体电气和热传输的知识，以及当将这些材料组装成批量形式时，如何保留这些材料的优点。该项目促进了半导体工程中下一代劳动力的教育和培训。其中包括以社区为中心的，面对面和虚拟外展计划，这些计划主要服务于芝加哥南侧的贫困群体。技术描述。该研究项目基于其二维形式的有利的电子带结构来探索热电学的泰氏素。大量退化带是更好的热电性能的关键特征。这项活动推进了有关热电和其他应用类似材料的研究。将系统地研究配体去除配体，以最大程度地减少界面对电运输的影响。载体密度调谐是2D半导体的一个具有挑战性的问题，将通过表面掺杂方案来解决。无机粘合剂的使用允许温度温度的组装来保留纳米级特征。电气和热传输属性的特性与Boltzmann的传输建模相辅相成，该模型对Tellurene的独特特征提供了深刻的了解。通过这项研究产生的知识将提供有关热电和其他设备应用程序未来材料设计的见解。该奖项反映了NSF的法定任务，并被认为是值得通过基金会的知识分子优点和更广泛的影响评估标准通过评估来获得支持的。