FMRG: Eco: Future Eco Manufacturing of Recyclable Soft Electronics

FMRG：Eco：可回收软电子产品的未来生态制造

• 批准号: 2134664
• 负责人: Yong Zhu
• 金额: $ 299.87万
• 依托单位: North Carolina State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-01-01 至 2025-12-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2134664&HistoricalAwards=false
• 关键词: FMRG; Eco; Future; Manufacturing; Recyclable

This Future Manufacturing Research Grant (FMRG) EcoManufacturing project will enable eco manufacturing of recyclable soft electronics by seamlessly integrating a select group of biodegradable/recyclable materials and sustainable manufacturing processes, guided by economic and environmental life-cycle assessment. The rapidly increasing number of electronic devices that have decreasing lifetime in use pose three important challenges: (1) a huge amount of waste from used electronics, (2) rapid consumption of scarce elements, and (3) enormous energy consumption for manufacturing electronic devices. On the other hand, soft electronics is an emerging field. Therefore, the team will develop new classes of soft electronics that are created from renewable materials using energy-efficient manufacturing processes, and that can either be degraded naturally or repurposed into high-value products after their lifetime. The project will bring together researchers in flexible/stretchable electronics, polymer chemistry, chemical and materials engineering, manufacturing engineering, sustainability, and science education. This interdisciplinary convergence project will provide a compelling basis to train a diverse cohort of future engineers and scientists. The education and workforce development efforts will include curriculum innovation, teacher professional development, outreach, and student internships, with a commitment to increasing the diversity in the workforce.This project is structured in five thrust areas addressing materials development, eco manufacturing, biodegradation/recycling, environmental and economic life-cycle assessment, and education and workforce development. More specifically, the project team will design reinforced cellulose composite as the substrate, new conjugated polymer as the semiconductor, composite with selected fillers as the dielectric, and silver nanowire network as the conductor. The research will address the challenges of developing high-performance materials that are renewable, biodegradable or recyclable. It will result in a viable all-printing-based manufacturing framework to enable the scalable fabrication of sustainable soft electronics. The scalability will be demonstrated with a laboratory-scale roll-to-roll system. The device components at their end of life will follow three routes – biodegradation (back to nature), recycling (back to manufacturing), or upcycling (converting to value-added new materials). The project will incorporate biodegradation and material circularity into the life-cycle assessment framework for soft electronics.This Future Manufacturing project is jointly funded by the Divisions of Civil, Mechanical and Manufacturing Innovation (CMMI), Electrical, Communication, and Cyber Systems (ECCS), and Engineering Education and Centers (EEC) in the Directorate of Engineering, and by the Divisions of Chemistry (CHE) and Materials Research (DMR) in the Directorate for Mathematical and Physical Sciences (MPS).This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该未来制造研究补助金 (FMRG) 生态制造项目将在经济和环境生命周期评估的指导下，通过无缝集成精选的一组可生物降解/可回收材料和可持续制造工艺，实现可回收软电子产品的生态制造。使用寿命缩短的设备带来了三个重要挑战：（1）废旧电子产品产生大量废物，（2）稀缺元素的快速消耗，以及（3）制造电子设备的巨大能源消耗。因此，该团队将开发采用节能制造工艺的可再生材料制成的新型软电子产品，这些电子产品可以自然降解，也可以在项目寿命结束后重新用于高价值产品。该跨学科融合项目将汇集柔性/可拉伸电子、聚合物化学、化学和材料工程、制造工程、可持续发展和科学教育领域的研究人员，为培养未来的工程师和科学家提供令人信服的基础。劳动力发展工作将包括课程创新、教师专业发展、外展和学生实习，致力于增加劳动力的多样性。该项目分为五个重点领域，涉及材料开发、生态制造、生物降解/回收、环境和经济生命周期评估更具体地说，项目团队将设计增强纤维素复合材料作为基材，新型共轭聚合物作为半导体，以选定的填料作为电介质的复合材料，以及银纳米线网络作为导体。发展的挑战可再生、可生物降解或可回收的高性能材料将产生一个可行的全印刷制造框架，以实现可持续软电子产品的可扩展制造。设备组件在使用寿命结束时将遵循三种途径——生物降解（回归自然）、回收（回归制造）或升级改造（转化为增值新材料）。将生物降解和材料循环纳入软电子的生命周期评估框架。这个未来制造项目由土木、机械和制造创新部门（CMMI）、电气、通信和网络系统部门（ECCS）和工程部的工程教育和中心 (EEC)，以及数学和物理科学部 (MPS) 的化学部 (CHE) 和材料研究部 (DMR)。该奖项反映了通过使用基金会的智力价值和更广泛的影响审查标准进行评估，NSF 的法定使命被认为值得支持。

项目成果

All Electrohydrodynamic Printed Flexible Organic Thin Film Transistors

• DOI: 10.1002/admt.202300410
• 发表时间: 2023-06
• 期刊: Advanced Materials Technologies
• 影响因子: 6.8
• 作者: Ping Ren;Runqiao Song;Yong Zhu;B. O’Connor;Jingyan Dong

Fluid Flow Templating of Polymeric Soft Matter with Diverse Morphologies

具有不同形态的聚合物软物质的流体流动模板

• DOI: 10.1002/adma.202211438
• 发表时间: 2023
• 期刊: Advanced Materials
• 影响因子: 29.4
• 作者: Bang, Rachel S.;Roh, Sangchul;Williams, Austin H.;Stoyanov, Simeon D.;Velev, Orlin D.
• 通讯作者: Velev, Orlin D.

Eco-friendly screen printing of silver nanowires for flexible and stretchable electronics

用于柔性和可拉伸电子产品的银纳米线的环保丝网印刷

• DOI: 10.1039/d2nr05840e
• 发表时间: 2023
• 期刊: Nanoscale
• 影响因子: 6.7
• 作者: Shukla, Darpan;Liu, Yuxuan;Zhu, Yong
• 通讯作者: Zhu, Yong

Electrohydrodynamic Printed PEDOT:PSS/Graphene/PVA Circuits for Sustainable and Foldable Electronics

• DOI: 10.1002/admt.202301045
• 发表时间: 2023-08
• 期刊: Advanced Materials Technologies
• 影响因子: 6.8
• 作者: Ping Ren;Jingyan Dong

Hierarchically reinforced biopolymer composite films as multifunctional plastics substitute

• DOI: 10.1016/j.xcrp.2023.101732
• 发表时间: 2023-12
• 期刊: Cell Reports Physical Science
• 影响因子: 8.9
• 作者: Y. Kotb;O. Velev