Collaborative Research: SHF: Small: Tangram: Scaling into the Exascale Era with Reconfigurable Aggregated "Virtual Chips"

合作研究：SHF：小型：七巧板：通过可重构聚合“虚拟芯片”扩展到百亿亿次时代

基本信息

批准号：
2008477
负责人：
Hongyi Wu
金额：
$ 21.34万
依托单位：
Old Dominion University Research Foundation
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2020
资助国家：
美国
起止时间：
2020-07-15 至 2022-10-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=2008477&HistoricalAwards=false
关键词：
Collaborative Research SHF Small Tangram

项目摘要

The design of general-purpose processors is reaching a performance bottleneck due to the limitations in technology scaling. Chiplet-based systems offer a promising solution by integrating small dies (chiplets) inside one package. Chiplets also enable heterogeneous integration of discrete chip architectures, such as CPUs, GPUs, DSPs, and FPGAs. However, the design of high-performance chiplet-based systems faces serious challenges: inter-chiplet communication is a critical bottleneck; resource needs to be efficiently shared among the chiplets to improve the performance-cost ratio; power and thermal management need to be optimized for better in-package integration. Consequently, such designs need to take a more holistic approach, and investigations are needed on the cross-cutting issues across the processing nodes, storage and interconnection fabric. This research proposes to build "virtual chips" from heterogeneous aggregated chiplets, so that the system can not only reap the performance benefit of a monolithic super chip but also break the scalability bottleneck. A major outcome of the project will be a set of optimization methods that enable the design of a reconfigurable architecture, leveraging a hybrid wireless interconnection to seamlessly connect the computing and memory components. To this end, the research goals include: (1) design of reconfigurable architectures to break the chiplet boundaries for efficient resource sharing; (2) development of models to quantify interactions between the applications and hardware resources for fast design-space exploration; (3) design of a hybrid wireless interconnection network to seamlessly bridge the physical gaps between chiplets and enable reconfigurable architectures through the flexibility of wireless networks; and (4) design of novel wireless antennas to improve energy and thermal efficiency.The proposed research bridges the gap between multiple layers of the design stack: hardware architectures, networks and devices. Due to its cross-cutting nature, the proposed research has the potential to transform the design of high-performance, energy-efficient and cost-effective systems that are able to meet the demand of emerging applications with growing bandwidth and performance needs. The educational contributions of this research include integrating research with teaching and training, design of tutorials and workshops focusing on the training of future engineers, and interaction with industry to accelerate technology transfer. Through the outreach activities as part of the proposed project, more undergraduate and minority students will be attracted to this field of engineering.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

由于技术扩展的限制，通用处理器的设计正在达到性能瓶颈。基于小芯片的系统通过将小芯片（小芯片）集成到一个封装内，提供了一种有前景的解决方案。 Chiplet 还支持离散芯片架构的异构集成，例如 CPU、GPU、DSP 和 FPGA。然而，基于chiplet的高性能系统的设计面临着严峻的挑战：chiplet间的通信是一个关键瓶颈； Chiplet之间需要高效共享资源，提高性价比；需要优化电源和热管理以实现更好的封装内集成。因此，此类设计需要采取更全面的方法，并且需要对处理节点、存储和互连结构之间的交叉问题进行调查。这项研究提出从异构聚合的小芯片中构建“虚拟芯片”，使系统不仅可以获得单片超级芯片的性能优势，还可以突破可扩展性瓶颈。该项目的主要成果将是一套优化方法，能够设计可重新配置的架构，利用混合无线互连来无缝连接计算和内存组件。为此，研究目标包括：（1）设计可重构架构，打破chiplet边界，实现高效资源共享； (2) 开发模型来量化应用程序和硬件资源之间的交互，以实现快速设计空间探索； (3) 设计混合无线互连网络，以无缝弥合小芯片之间的物理间隙，并通过无线网络的灵活性实现可重构架构； (4) 设计新型无线天线以提高能量和热效率。所提出的研究弥合了设计堆栈多层之间的差距：硬件架构、网络和设备。由于其交叉性质，所提出的研究有可能改变高性能、节能和具有成本效益的系统的设计，这些系统能够满足带宽和性能需求不断增长的新兴应用的需求。这项研究的教育贡献包括将研究与教学和培训相结合，设计专注于未来工程师培训的教程和研讨会，以及与行业互动以加速技术转让。通过作为拟议项目一部分的外展活动，更多的本科生和少数族裔学生将被吸引到这一工程领域。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。