GOALI: Mechanics and Dynamics of Machining with Applied Chip Tension

目标:应用切屑张力的加工力学和动力学

基本信息

  • 批准号:
    1661926
  • 负责人:
  • 金额:
    $ 31.5万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2017
  • 资助国家:
    美国
  • 起止时间:
    2017-05-15 至 2021-04-30
  • 项目状态:
    已结题

项目摘要

This Grant Opportunity for Academic Liaison with Industry (GOALI) award supports fundamental research on enhancement of material shearing mechanisms in machining processes, using an approach that also controls friction. The chip in metal cutting is treated as a by-product, typically as waste. However, this new approach attempts to use the chip by applying tension and thereby reduce and cancel friction forces in machining. By attenuating friction forces, this new turning process assisted by chip-pulling can enable material removal with much lower cutting effort and energy; provide greater stability margins, longer tool-life, and facilitate high-throughput energy efficient precision manufacturing. A potential mechanism of suppressing the chip-jam with tailored cutting tool geometries is also likely with the new approach. Collaboration with a partner from US aerospace industry will help ensure the technology transfer. The research focus is to investigate how tension applied on the cut chip during machining processes affects cutting mechanics and dynamics. Effective use of the cut chip requires robust control of its flow. Micro-textured tools will be designed to control and navigate the chip flow to realize application of tension. Analytical models will be developed to understand the link between micro-grooved tool geometry to the chip flow mechanics and chip flow controllability. The effect of applying tension on the cut chip will be investigated. Tension applied to the chip cancels the friction force on the rake face and reduces the cutting effort while improving cutting mechanics. Analytical models and experimental characterization will be performed to understand the effect of pulling the chip on resultant cutting forces, cutting energy, the dynamic relation amongst them, and the limitations. Based on this understanding, chip tension will be introduced as an innovative process control parameter to improve static and dynamic characteristics of the machining process. Machining of precision parts can be realized with lower form errors by minimizing overall cutting forces through chip tension and force control. Reduced machining cycle times and increased material removal rates can be achieved through greater chatter stability margins that can be attained by modulating the chip tension jointly with process parameters.
这项与行业联络的赠款机会(Goali)奖基础研究基础研究有关加工过程中材料剪切机制的增强,并使用一种也可以控制摩擦的方法。金属切割中的芯片通常被视为副产品,通常为废物。但是,这种新方法试图通过施加张力来使用芯片,从而减少并取消加工中的摩擦力。通过衰减摩擦力,通过筹码辅助的这种新的转弯工艺可以通过降低的切割和能量来清除材料。提供更大的稳定性边缘,更长的工具寿命,并促进高通量能源有效的精确制造。新方法也很可能是用量身定制的切割工具几何形状抑制芯片JAM的潜在机制。与美国航空航天行业的合作伙伴的合作将有助于确保技术转移。研究重点是调查加工过程中如何对切割芯片应用的张力会影响切割的力学和动力学。有效使用切割芯片需要对其流量进行强大的控制。微型纹理工具将旨在控制和导航芯片流以实现张力的应用。将开发分析模型,以了解微螺旋的工具几何形状与芯片流力学和芯片流量可控性之间的联系。将研究施加张力对切割芯片的影响。 Tension applied to the chip cancels the friction force on the rake face and reduces the cutting effort while improving cutting mechanics.将执行分析模型和实验表征,以了解将芯片拉动对产生的切割力,切割能量,它们之间的动态关系以及局限性的效果。基于这种理解,将引入芯片张力作为创新过程控制参数,以改善加工过程的静态和动态特征。通过芯片张力和力控制,可以最大程度地减少整体切割力,可以通过较低的形式误差来实现精确零件的加工。可以通过更大的聊天稳定性边缘来实现加工周期时间的减​​少和增加的材料去除率,这可以通过使用过程参数共同调节芯片张力来实现。

项目成果

期刊论文数量(7)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Active control of high frequency chatter with machine tool feed drives in turning
  • DOI:
    10.1016/j.cirp.2021.04.060
  • 发表时间:
    2021-07-09
  • 期刊:
  • 影响因子:
    4.1
  • 作者:
    Dumanli, Alper;Sencer, Burak
  • 通讯作者:
    Sencer, Burak
High Performance Turning Assisted by Chip-Pulling
排屑辅助高性能车削
Pre-compensation of servo tracking errors through data-based reference trajectory modification
  • DOI:
    10.1016/j.cirp.2019.03.017
  • 发表时间:
    2019-01-01
  • 期刊:
  • 影响因子:
    4.1
  • 作者:
    Dumanli, Alper;Sencer, Burak
  • 通讯作者:
    Sencer, Burak
Auto-Tuning of Precision Servo Controllers Suffering from Large Mass Ratio Induced Vibrations
遭受大质量比引起振动的精密伺服控制器的自动调谐
A new turning system assisted by chip-pulling
一种新型的排屑辅助车削系统
  • DOI:
    10.1016/j.jmapro.2018.03.044
  • 发表时间:
    2018
  • 期刊:
  • 影响因子:
    6.2
  • 作者:
    Sencer, Burak;Maulimov, Mukhtar
  • 通讯作者:
    Maulimov, Mukhtar
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Burak Sencer其他文献

Development of a Chip Pulling System for Efficient Turning
  • DOI:
    10.1016/j.procir.2014.03.092
  • 发表时间:
    2014-01-01
  • 期刊:
  • 影响因子:
  • 作者:
    Burak Sencer;Tomoya Aoki;Eiji Shamoto;Takumi Hasegawa;Tomio Koide
  • 通讯作者:
    Tomio Koide
Novel deconvolution based feedrate scheduling towards a new class of CAM for time-dependent processes
基于新型反卷积的进给率调度,针对时间相关过程的新型 CAM
  • DOI:
  • 发表时间:
    2022
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Shuntaro Yamato;Burak Sencer;Anthony Beaucamp
  • 通讯作者:
    Anthony Beaucamp
Accurate prediction of machining cycle times by data-driven modelling of NC system's interpolation dynamics
  • DOI:
    10.1016/j.cirp.2022.04.017
  • 发表时间:
    2022-01-01
  • 期刊:
  • 影响因子:
  • 作者:
    Masafumi Endo;Burak Sencer
  • 通讯作者:
    Burak Sencer
A Sliding Made Controller Design for Position Synchronization of Dual Spindle Servo Systems
双主轴伺服系统位置同步的滑动控制器设计
  • DOI:
  • 发表时间:
    2012
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Burak Sencer;Eiji Shamoto
  • 通讯作者:
    Eiji Shamoto
Adaptive Torque Ripple Compensation Technique Based on the Variable Structure Control and its Applications to Gear Driven Motion Systems
基于变结构控制的自适应扭矩脉动补偿技术及其在齿轮传动运动系统中的应用
  • DOI:
  • 发表时间:
    2013
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Burak Sencer;Eiji Shamoto
  • 通讯作者:
    Eiji Shamoto

Burak Sencer的其他文献

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{{ truncateString('Burak Sencer', 18)}}的其他基金

GOALI: Fundamental Investigation of Constrained Cutting for High Performance Machining of Difficult-to-Cut Materials
GOALI:难切削材料高性能加工约束切削的基础研究
  • 批准号:
    2323120
  • 财政年份:
    2024
  • 资助金额:
    $ 31.5万
  • 项目类别:
    Standard Grant
GOALI/Collaborative Research: Mechanics and Dynamics of Low Frequency Vibration Assisted Machining
GOALI/合作研究:低频振动辅助加工的力学和动力学
  • 批准号:
    2019370
  • 财政年份:
    2020
  • 资助金额:
    $ 31.5万
  • 项目类别:
    Standard Grant

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