I-Corps: Thermal Interface Materials with Ultrahigh Thermal Conductivity and Superior Conformability for Effective Cooling of Electronic Components

I-Corps：具有超高导热性和卓越适形性的热界面材料，可有效冷却电子元件

• 批准号: 1559627
• 负责人: Mustafa Akbulut
• 金额: $ 5万
• 依托单位: Texas A&M Engineering Experiment Station
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2015
• 资助国家: 美国
• 起止时间: 2015-09-01 至 2016-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1559627&HistoricalAwards=false
• 关键词: Corps; Thermal; Interface; Materials; Ultrahigh

There is an increase in demand for smaller, lighter and more efficient electronic devices to simplify our everyday life, protect the environment, expand global access to education and decrease energy consumption. However, overheating in these devices has been a key issue which has prevented existing technology from meeting key application requirements in this space, and has prevented the necessary improvements in technology for future electronic devices to fully meet the small size, high power and high reliability specifications for personal applications. The range of materials available to promote device cooling has been largely unchanged for more than a decade and their performance improvements are lagging behind the advances made in electronics applications. This team has developed a new material, which can manage heat very effectively and as a result enable electronics to operate faster, more accurately and reliably. Electronics industries dealing with high-power processors, high-intensity LEDs, vehicle electronics, telecommunication infrastructure, and semiconductor chip packaging can significantly benefit from our new technology. In addition, the use of batteries in automotive and home-power landscapes is exponentially increasing. Overheating remains a critical issue affecting the safety and limiting the performance of such batteries. Alternative power generation technologies such as wind and solar also rely on robust power storage solutions ? all of which will be enhanced by access to next-generation thermal management technology.This team seeks to commercialize a novel Thermal Interface Material (TIM) which will be useful in cooling next-generation microprocessors, circuits and electronic devices. The thermal performance of current generation TIMs peaks at a conductivity value of approximately 80 W/(m.K). The proposed new material has ultra-high thermal conductivity much greater than 250 W/(m.K). The project involves the use of ceramic nanosheets functionalized with soft ligands, which are then electrocodeposited in a metal matrix, creating a soft and compliant metal which retains its high conductivity. The proposed technology therefore provides a hybrid nanocomposite which is a combination of metallic, ceramic, and organic microstructures. The team expects that as demands for improved energy efficiency and thermal management continue to increase that the proposed technology may have a wide-ranging positive impact on lowering the energy used for cooling purposes, among other benefits.

为了简化我们的日常生活、保护环境、扩大全球教育机会并降低能源消耗，对更小、更轻和更高效的电子设备的需求不断增加。然而，这些器件的过热问题一直是阻碍现有技术满足该领域关键应用要求的关键问题，也阻碍了未来电子器件进行必要的技术改进，以充分满足小尺寸、高功率和高可靠性的规格。用于个人应用。十多年来，可用于促进设备冷却的材料范围基本没有变化，其性能改进落后于电子应用的进步。该团队开发了一种新材料，可以非常有效地管理热量，从而使电子设备能够更快、更准确、更可靠地运行。涉及高功率处理器、高强度 LED、汽车电子、电信基础设施和半导体芯片封装的电子行业可以从我们的新技术中受益匪浅。此外，电池在汽车和家庭电源领域的使用呈指数级增长。过热仍然是影响此类电池安全和限制性能的关键问题。风能和太阳能等替代发电技术也依赖于强大的电力存储解决方案？所有这些都将通过使用下一代热管理技术得到增强。该团队致力于将一种新型热界面材料（TIM）商业化，该材料将有助于冷却下一代微处理器、电路和电子设备。当前一代 TIM 的热性能在电导率值约为 80 W/(m.K) 时达到峰值。所提出的新材料具有远大于 250 W/(m.K) 的超高导热率。该项目涉及使用软配体功能化的陶瓷纳米片，然后将其电沉积在金属基质中，形成柔软且柔顺的金属，并保持其高导电性。因此，所提出的技术提供了一种混合纳米复合材料，它是金属、陶瓷和有机微观结构的组合。该团队预计，随着对提高能源效率和热管理的需求不断增加，所提议的技术可能会对降低用于冷却目的的能源产生广泛的积极影响以及其他好处。