SHF: Medium: ASKS - Architecture Support for darK Silicon

SHF：中：ASKS - 对 darK Silicon 的架构支持

• 批准号: 1500848
• 负责人: Yuan Xie
• 金额: $ 89.64万
• 依托单位: University of California-Santa Barbara
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-08-16 至 2019-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1500848&HistoricalAwards=false
• 关键词: SHF; Medium; ASKS; Architecture; Support

The proposed ASKS (Architecture Support for darK Silicon) project proposes architectural support for future many-core microprocessors designed with and around emerging technologies to address the challenges of the coming dark silicon revolution. Future many-cores, to stay on the historical performance curve, will contain more transistors than can all be sustainably powered at the same time. Thus, we face the prospect of ?dark silicon,? wherein some of a chip?s components must be powered-off (darkened) in order to stay within the chip?s power/thermal budget. Ensuring peak performance under these circumstances is a challenging task. In particular, in an architecture with different types of components (cores, caches, network on chip (NoC, or on-chip interconnet), memory controllers, etc.), there can be many different on-dim-dark configurations within the power budget. However, these can exhibit significantly varying performances. Additionally, the power consumption of uncore components (shared caches, on-chip interconnect, memory architecture) is significant, thus the uncore components play an important role in joint performance/power/thermal optimization. Therefore, a more inclusive approach is needed. Our architectural design space exploration will mainly focus on the uncore space (shared caches, on-chip interconnect structures, memory architecture), targeting future NoC-based many-core microprocessors that exploit the emerging technologies of 3D die-stacking (3D IC) and non-volatile memories (NVM). This project will advance the state of the art in preparing for the dark silicon revolution in two main aspects. 1) Cross-layer holistic optimization with a focus on uncore components: The uncore components play important roles in joint performance/power/thermal optimization. This project proposes an integrated approach in which the cores and uncore components collaborate to maximize performance under power and thermal constraints as well as under dynamically changing program behavior and execution parameters. 2) Investigating dark silicon in the context of emerging technologies: Emerging 3D ICs and NVM technologies are envisioned as promising ways to design future many-core architectures. The adoption of such emerging technologies poses new challenges for dark silicon (such as aggravated thermal profiles in 3D stacked chips), but also brings new opportunities for architectural innovations such as novel power management techniques and greater exploitation of memory system heterogeneity. The broader impact of this project includes the contribution to the increased performance for future microprocessors even in the face of the coming dark silicon revolution. Through close collaboration with several industry partners, the PIs envision direct transfer of many ideas to industry. The tools and techniques developed in this project will be used in teaching existing courses and developing new courses, and will be made available through the web for use by other educators, researchers, and industry practitioners. Dissemination of research findings will also be carried out through conference tutorials, panel discussions, and workshops. A concerted effort will be made to involve under-represented groups and undergraduate students in this research.

拟议的 ASKS（暗硅架构支持）项目提出了对未来多核微处理器的架构支持，这些微处理器采用新兴技术并围绕新兴技术进行设计，以应对即将到来的暗硅革命的挑战。为了保持历史性能曲线，未来的多核将包含比同时可持续供电的晶体管更多的晶体管。 因此，我们面临着“暗硅”的前景。其中，芯片的某些组件必须关闭（变暗），以便保持在芯片的功率/热预算范围内。在这种情况下确保最佳性能是一项具有挑战性的任务。特别是，在具有不同类型组件（核心、缓存、片上网络（NoC 或片上互连）、内存控制器等）的架构中，电源内部可能存在许多不同的明暗配置。预算。然而，这些可能表现出显着不同的性能。此外，非核心组件（共享缓存、片上互连、内存架构）的功耗很大，因此非核心组件在联合性能/功耗/热优化中发挥着重要作用。因此，需要一种更具包容性的方法。我们的架构设计空间探索将主要集中在非核心空间（共享缓存、片上互连结构、内存架构），目标是未来基于 NoC 的多核微处理器，这些微处理器利用新兴的 3D 芯片堆叠（3D IC）技术和非易失性存储器（NVM）。该项目将从两个主要方面推进暗硅革命的最新技术水平。 1）以非核心组件为重点的跨层整体优化：非核心组件在联合性能/功耗/热优化中发挥着重要作用。该项目提出了一种集成方法，其中核心和非核心组件协作，以在功率和热量限制以及动态变化的程序行为和执行参数下最大限度地提高性能。 2) 在新兴技术的背景下研究暗硅：新兴的 3D IC 和 NVM 技术被认为是设计未来多核架构的有前途的方法。此类新兴技术的采用给暗硅带来了新的挑战（例如 3D 堆叠芯片中加剧的热分布），但也为架构创新带来了新的机遇，例如新颖的电源管理技术和更大程度地利用存储系统异质性。该项目的更广泛影响包括即使面对即将到来的暗硅革命，也能为提高未来微处理器的性能做出贡献。 通过与多个行业合作伙伴的密切合作，PI 设想将许多想法直接转移到行业。 该项目开发的工具和技术将用于教授现有课程和开发新课程，并将通过网络提供给其他教育工作者、研究人员和行业从业者使用。研究成果的传播也将通过会议教程、小组讨论和研讨会进行。我们将共同努力让代表性不足的群体和本科生参与这项研究。