Student Support: The 6th CIRP Conference on High Performance Cutting (HPC2014); University of California, Berkeley; June 23-25, 2014

学生支持：第六届 CIRP 高性能切削会议 (HPC2014)；

• 批准号: 1411221
• 负责人: David Dornfeld
• 金额: $ 1.8万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-04-01 至 2015-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1411221&HistoricalAwards=false
• 关键词: Student; Support; 6th; CIRP; Conference

This grant provides support to offset the costs for 40 students to attend the 6th CIRP Conference on High Performance Cutting, which will be hosted at the University of California, Berkeley from June 23-25, 2014. This conference provides an international forum for manufacturing researchers and companies to review and discuss developments in advanced manufacturing technology. Topics that will be covered by the conference include: additive manufacturing, sustainable manufacturing, and data-driven manufacturing (e.g., interoperability and big data). Selected students will attend technical presentations and interact and network with peers and senior manufacturing researchers. These students will be selected based on the following criteria: presenters of papers selected for the conference; quality of submitted research statement; membership in traditionally underrepresented groups in engineering and the sciences; and co-authors of papers accepted for the conference.The proceedings of the conference will be made freely available online through Elsevier Procedia CIRP. Furthermore, selected students will be able to present, discuss, exchange, and develop their research ideas in the area of advanced manufacturing. They will also be able to interact with local industries and learn more about recent trends in advanced manufacturing technology. These experiences can help develop the students' technical and communication skills as well as provide opportunities for strong collaborative ties with other peers and researchers in the community. This can help foster new ideas and enable attending students to use their talents and skills to drive continued American efforts that strengthen the competitiveness of manufacturing in the United States.

这笔赠款将支持 40 名学生参加第六届 CIRP 高性能切削会议，该会议将于 2014 年 6 月 23 日至 25 日在加州大学伯克利分校举办。该会议为制造研究人员提供了一个国际论坛和公司回顾和讨论先进制造技术的发展。会议将涵盖的主题包括：增材制造、可持续制造和数据驱动制造（例如互操作性和大数据）。选定的学生将参加技术演示，并与同行和高级制造研究人员互动和交流。这些学生将根据以下标准进行选择： 会议所选论文的演讲者；提交的研究报告的质量；工程和科学领域传统上代表性不足的群体的成员资格；以及会议接受论文的共同作者。会议记录将通过 Elsevier Procedia CIRP 在网上免费提供。此外，入选的学生将能够展示、讨论、交流和发展他们在先进制造领域的研究想法。他们还将能够与当地行业互动，并更多地了解先进制造技术的最新趋势。这些经验可以帮助培养学生的技术和沟通技能，并为与社区中的其他同行和研究人员建立牢固的合作关系提供机会。这可以帮助培育新想法，并使就读的学生能够利用他们的才能和技能来推动美国继续努力，增强美国制造业的竞争力。