SBIR Phase II: Micro Laser Assisted Machining

SBIR 第二阶段：微型激光辅助加工

• 批准号: 1330439
• 负责人: Deepak Ravindra
• 金额: $ 64.91万
• 依托单位: MICRO-LAM, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-09-01 至 2018-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1330439&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Micro; Laser

This Small Business Innovation Research (SBIR) Phase II project enables an innovative high-productivity approach to manufacturing hard and brittle materials like ceramics, semiconductors, and glass. The objective of this proposal is to build on the successful Phase I feasibility study to demonstrate an efficient and productive method that could manufacture ceramic and semiconductors with excellent part quality. The process, termed Micro-Laser Assisted Machining (micro-LAM), allows a cheaper (~40-60%), faster (by two to five times), and better method of machining and manufacturing hard and brittle materials by combining the preferential heat from a laser source and extreme pressure from a diamond tool. The status quo technology for manufacturing these materials requires extensive machining hours to obtain good part quality, which is not economical. The demand for high-end ceramics and semiconductors is continuously increasing; however, high production costs have forced manufacturers to use other materials with inferior properties. The goal of this effort is to address this unmet need by commercializing the micro-LAM technology by the end of Phase II. A minimum viable product will be tested at industrial partner sites to obtain firsthand customer feedback, which is key to accelerating the commercialization process.The broader impact/commercial potential of this project will be felt in semiconductor (microelectronics) manufacturing, optics (mirrors and windows), and precision mechanical products (bearing and seals), where the superior properties of advanced semiconductor and engineered ceramic materials are required to achieve performance criteria. This technology will enable entirely new capabilities for production of materials and products currently not viable or achievable due to processing limitations. The micro-LAM technology also has potential applications for emerging technologies, such as wind turbines and plug-in electric vehicles, where high-power and high-temperature operation of advanced devices is required. The current target market size, including optics, semiconductor, advanced ceramics and glass parts manufacturing, is approximately $250 million, with a 15%/year growth rate. Once market acceptance is established in the target market segment, the micro-LAM tooling will be launched into the larger diamond turning machine (DTM) market, with a total size of $2.4 billion. There are approximately 10,000 DTMs in the United States alone (with ~ 500 new tools introduced per year).

这项小型企业创新研究（SBIR）II期项目为制造陶瓷，半导体和玻璃等硬性和脆性材料提供了创新的高生产力方法。该提案的目的是建立成功的I期可行性研究，以证明一种有效且富有成效的方法，该方法可以以优质的质量生产陶瓷和半导体。该过程称为微激光辅助加工（Micro-LAM），可以更便宜（约40-60％），更快（使用两到五次），以及通过结合来自激光源的优先热量和钻石工具的极端压力来加工和制造硬质量和脆性材料的更好方法。制造这些材料的现状技术需要大量的加工时间才能获得良好的零件质量，这是不经济的。对高端陶瓷和半导体的需求不断增加。但是，高生产成本迫使制造商使用其他具有劣质性质的材料。 这项努力的目的是通过在第二阶段结束时通过商业化微型灯泡技术来解决这种未满足的需求。最低可行的产品将在工业合作伙伴站点进行测试，以获取第一手客户反馈，这是加速商业化过程的关键。该项目的更大影响/商业潜力将在半导体（微电源）制造，镜像（镜像和窗户）以及精确的机械产品（轴承和密封范围）的范围内（镜像和窗户），以及高级式绩效（轴承和密封）的高级物质（轴承和密封），以下是高级的效果。 标准。由于处理局限性，该技术将使目前不可行或无法实现的材料和产品的生产实现全新的功能。微型陆战技术还具有潜在的应用程序，例如风力涡轮机和插电式电动汽车，在这里需要高功率和高温操作。目前的目标市场规模，包括光学，半导体，高级陶瓷和玻璃零件制造，约为2.5亿美元，每年增长15％。一旦在目标市场领域建立了市场的接受度后，微型灯泡工具将被推入较大的钻石转盘机（DTM）市场，总尺寸为24亿美元。 仅在美国，就有大约10,000个DTM（每年引入约500个新工具）。