SHF: SMALL: Embedded Cooling of High-Performance ICs Using Novel Nanostructured Thermoelectrics: Multiscale Software Development and Device Optimization

SHF：小型：使用新型纳米结构热电材料的高性能 IC 嵌入式冷却：多尺度软件开发和设备优化

• 批准号: 1218839
• 负责人: Shaikh Ahmed
• 金额: $ 14.99万
• 依托单位: Southern Illinois University at Carbondale
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-07-01 至 2017-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1218839&HistoricalAwards=false
• 关键词: SHF; SMALL; Embedded; Cooling; Performance

Recently, nano-enabled thermoelectric devices have attracted much attention for cost-effective embedded (hot spot) and portable cooling applications such as in high-performance integrated circuits, lasers, and medical and food chillers. However, efficiency of this novel technology, to a large extent, relies on: (i) Fine-tuning the basic material parameters (Seebeck coefficient, electrical conductivity, and thermal conductivity) that are strong function of coupled structural-electronic processes at the nanoscale; and ii) System-level optimization considering the geometry, substrates, and contacts. These critical and challenging tasks have not yet been fully addressed and assessed experimentally and, therefore, demand a careful numerical investigation. As a response to this need, the goal of this research is to design nano-enabled embedded thermoelectric cooling modules offering improved efficiency and the ability to be operated at high temperature. For this purpose, a multiscale simulator will be integrated, where the material and device parameters will be obtained atomistically using first-principles and molecular dynamics simulations and will eventually be used in the system level design and optimization. The multiscale simulation platform will expose new degrees-of-freedom available at nanoscale (such as engineering density-of-states, effective mass, structural relaxation, localized disorder, surface-to-volume ratio, internal polarization, and non-degeneracy) and create transformative design routes for boosting efficiency and reliability of thermoelectric systems.Thermoelectric technology offers high power density and fast response, is vibration and noise free, small and lightweight, and environmentally safe. Besides applications in embedded and potable coolers, thermoelectric devices are used as power sources for remote telecommunication, navigation, and radioisotope generator for space vehicles, and has potential promise in heat scavenging in vehicle exhaust system. Solid-state thermoelectrics will thus diversify and help sustain the growth in the global semiconductor market. The project also encompasses significant education and outreach activities. Graduate students will be engaged in software development, integration, and data analysis. In addition, senior design projects will be developed for undergraduate students. The simulator, along with the documentation, tutorials, case studies, will be freely distributed under the GNU public use license and an educational version (with a graphical user interface) will be deployed on NSF?s nanoHUB.org for the broader community for use in research and class-room teaching activities.

最近，纳米热电设备在高性能集成电路、激光器、医疗和食品冷却器等经济高效的嵌入式（热点）和便携式冷却应用中引起了广泛关注。然而，这项新技术的效率在很大程度上取决于：（i）微调基本材料参数（塞贝克系数、电导率和热导率），这些参数是纳米级结构电子耦合过程的强大功能; ii) 考虑几何形状、基板和接触的系统级优化。这些关键且具有挑战性的任务尚未通过实验得到充分解决和评估，因此需要仔细的数值研究。为了满足这一需求，本研究的目标是设计纳米嵌入式热电冷却模块，提供更高的效率和在高温下运行的能力。为此，将集成一个多尺度模拟器，其中将使用第一原理和分子动力学模拟以原子方式获得材料和器件参数，并最终用于系统级设计和优化。多尺度模拟平台将揭示纳米尺度上的新自由度（例如工程状态密度、有效质量、结构松弛、局部无序、表面体积比、内部极化和非简并性）创建变革性设计路线，以提高热电系统的效率和可靠性。热电技术具有高功率密度和快速响应、无振动和噪音、体积小、重量轻且对环境安全的特点。除了在嵌入式和便携式冷却器中的应用外，热电器件还用作远程通信、导航和航天器放射性同位素发生器的电源，并且在车辆排气系统的热清除方面具有潜在前景。因此，固态热电器件将实现多元化，并有助于维持全球半导体市场的增长。该项目还包括重要的教育和外展活动。研究生将从事软件开发、集成和数据分析。此外，还将为本科生开发高级设计项目。该模拟器以及文档、教程、案例研究将在 GNU 公共使用许可证下免费分发，教育版本（带有图形用户界面）将部署在 NSF 的 nanoHUB.org 上，供更广泛的社区使用在研究和课堂教学活动中。