CAREER: Multi-Scale Study of Transport Phenomena in Printable Electronics for Enhanced Microstructure and Properties

职业：可印刷电子器件中输运现象的多尺度研究，以增强微观结构和性能

• 批准号: 0846825
• 负责人: Ying Sun
• 金额: $ 40万
• 依托单位: SUNY at Binghamton
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-03-01 至 2009-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0846825&HistoricalAwards=false
• 关键词: CAREER; Multi; Scale; Study; Transport

0846825Y. SunThis career plan will advance the fundamental understanding of transport processes of inkjet-printed functional materials on flexible substrates through the integration of innovative research and education. The proposed research combines novel modeling and experiments that include: (i) in-situ observation and multi-scale modeling of the flow, heat and mass transfer induced by the interplay of wetting, evaporation, and self-assembly of inkjet-deposited materials; (ii) laser and plasma substrate surface modification for improved deposition in a roll-to-roll (R2R) format; and (iii) microstructural and electrical-thermalmechanical property characterization of deposited material. The focus is on the mesoscopic scale, where Marangoni flow, evaporation, and particle self-assembly can be directly observed. A lattice Boltzmann model will be developed to directly simulate drop impact and evaporation on surface modified substrates; particle-particle, particle-carrier liquid, and particle-substrate interactions; and final morphology of deposited particulate materials. In contrast to previous experiments that have only been concerned with post-mortem analysis of deposited structures, the proposed experiments will integrate ultrafast confocal microscopy and micro-particle image velocimetry systems to monitor in real-time particle self-assembly during the evaporation phase and to provide model validations. The maskless laser patterning combined with plasma etching alters substrate surface energies and hence provides wetting controls for a confined deposition. The laser-created patterns with increased surface areas due to ablative roughening will enhance adhesion of the deposited materials. Modern characterization techniques (e.g., SEM, TEM, AFM, nano-indentation, and infrared microscopy) will be used to determine final microstructures as well as electrical, thermal, and mechanical properties of deposited materials.Intellectual Merit: Environmentally-benign R2R electronics fabrication using inkjet printing and direct laser patterning on flexible substrates is an enabling technology that will provide desired high-volume, low-cost production of flexible electronics. The proposed work will yield important understanding of how the final microstructure and properties of deposited materials depend on the electronic ink formulation, processing conditions, and substrate properties. The intrinsic limits on the spatial accuracy of ink-jetting devices, wetting, de-wetting, contact line pinning, interfacial instabilities, microflows within the deposited drop, and the self-assembly of particulate matter during drop evaporation all contribute to the lack of precise control of deposited electronic materials. The pre-patterned substrate surface will provide preferential wetting and dewetting of the inkjetted material and better substrate adhesion. This will enable more reliable deposition patterns with better edge definition, higher resolution, and improved electrical-thermal-mechanical properties of printable electronics and devices. This project will also impact other research frontiers on complex fluids involving phase change and particle assembly.Broader Impacts: This project is an excellent fit to the strategic directions of the Center for Advanced Microelectronics Manufacturing, a national microelectronics R2R manufacturing R&D center at Binghamton. Knowledge obtained from this project will have a dramatic impact on the processing of printable electronics, ranging from low-cost consumer products, solar cells, and low-power lighting to highly specialized small scale sensors and healthcare devices. The integrated education plan seeks to enhance thermo-fluid science education through the development of new courses to highlight multiscale modeling and nanoscale phenomena at both graduate and undergraduate levels. As an offshoot of the proposed computational modeling work, courseware for virtual thermo-fluid laboratories will be developed. Through recruiting visits at local secondary schools and involvement with the local Society of Women Engineers chapter, a sustained effort to attract women and other under-represented students in engineering programs will be made. Printable electronics will be demonstrated at the Watson Engineer's Week Open House and through Summer Science Camp at the Discovery Center in Binghamton. Seminars on the processing of flexible electronics for mid-career professionals will emphasize on the structureproperty-performance relationships. The partnership with Endicott Interconnect on laser surface treatment will enable internship opportunities and foster the research to innovation transition. The collaboration with novel ink and substrate providers (e.g., Corning) will allow us to customize ink and substrate formulas for each specific application. The joint effort between the PI and Computer Science faculty at Binghamton will advance the grid computing capability via the partnership with the New York State Grid.

0846825y。 Sunthis职业计划将通过整合创新研究和教育的整合来促进对柔性基板的印刷功能材料的运输过程的基本理解。 拟议的研究结合了新的建模和实验，其中包括：（i）由润湿，蒸发和自组装的材料的相互作用引起的流动，热量和质量转移的原位观察和多尺度建模； （ii）激光和等离子体底物表面修饰，以改进卷到卷（R2R）格式的沉积； （iii）沉积材料的微观结构和热机电特性表征。重点放在介观量表上，可以直接观察到Marangoni流，蒸发和粒子自组装。将开发一个晶格玻尔兹曼模型，以直接模拟对表面修饰的底物的滴效果和蒸发；颗粒粒子，颗粒载体液体和颗粒 - 底物相互作用；和沉积颗粒物材料的最终形态。与以前仅与沉积结构的验尸分析有关的实验相反，所提出的实验将整合超快共聚焦显微镜和微颗粒图像速度级别的系统，以在蒸发阶段进行实时粒子自组装监测并提供模型验证。无掩模的激光图案与等离子蚀刻结合，改变了底物表面能，因此为限制沉积提供了润湿控制。由于消融粗糙而导致的表面积增加的激光创建图案将增强沉积材料的粘附。 Modern characterization techniques (e.g., SEM, TEM, AFM, nano-indentation, and infrared microscopy) will be used to determine final microstructures as well as electrical, thermal, and mechanical properties of deposited materials.Intellectual Merit: Environmentally-benign R2R electronics fabrication using inkjet printing and direct laser patterning on flexible substrates is an enabling technology that will provide desired高体积，低成本的柔性电子产品。所提出的工作将对沉积材料的最终微观结构和特性如何取决于电子墨水公式，加工条件和底物特性。墨水射流设备的空间精度，润湿，润湿，接触线固定，界面不稳定性，沉积液滴中的微流以及滴落蒸发期间的颗粒物物质自组装的固有限制都导致缺乏沉积的电资源控制。预图案的基材表面将提供墨水材料的优先润湿和脱水，并提供更好的底物粘附。这将使更可靠的沉积模式具有更好的边缘定义，更高的分辨率以及可打印的电子设备和设备的改进的电动机械特性。该项目还将影响其他研究前沿对涉及相变和粒子组装的复杂流体。Boader的影响：该项目非常适合宾厄姆顿（Binghamton）的国家微电子R2R Manufacturing R＆D中心的高级微电子制造中心的战略方向。从该项目获得的知识将对可打印电子产品的处理产生巨大影响，从低成本的消费产品，太阳能电池和低功率照明到高度专业的小型传感器和医疗保健设备。综合教育计划旨在通过开发新课程来增强热流体科学教育，以突出研究生和本科阶段的多尺度建模和纳米级现象。作为建议的计算建模工作的分支，将开发虚拟热流体实验室的课程。通过在当地中学招募访问并参与了当地女工程师章节，将持续努力吸引妇女和其他代表性不足的学生在工程课程中。可打印的电子产品将在沃森工程师周开放日子和宾厄姆顿发现中心的夏季科学训练营中展示。有关中级专业人员的灵活电子产品处理的研讨会将强调结构性的性能关系。与Endicott Internect在激光表面处理方面的伙伴关系将使实习机会并促进研究进行创新过渡。与新型墨水和底物提供商（例如，康宁）的合作将使我们可以为每个特定应用程序自定义墨水和底物公式。 Binghamton的PI与计算机科学学院之间的共同努力将通过与纽约州电网的合作伙伴关系来提高网格计算能力。