CAREER: Engineered Substrates of Semiconductor Alloys: A Fundamentally-Based Novel Approach

职业：半导体合金工程基底：一种基于基础的新颖方法

• 批准号: 0093706
• 负责人: Partha Dutta
• 金额: $ 37.5万
• 依托单位: Rensselaer Polytechnic Institute
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-02-01 至 2006-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0093706&HistoricalAwards=false
• 关键词: CAREER; Engineered; Substrates; Semiconductor; Alloys

The research aspect of this CAREER proposal focuses on a novel andfundamental approach for fabricating and engineering tunable band gap and latticeconstant multi-component semiconductor substrates for optoelectronic, photonic, highspeed electronic, spintronic, micro-electro-mechanical systems and photovoltaicapplications. The proposed substrate engineering technology is based upon severaladvanced concepts recently developed in the areas of ternary and quaternary bulk crystalgrowth from melts, thermodynamic modeling of multi-component alloys, and interfacialdefect generation by the principal investigator. As a part of this career award, a newSubstrate Engineering Reactor will be designed and installed for compatible multi-componentsubstrate growth and hetero-epitaxy. Multi-component engineered substratesof III-V compounds and related device structures will be fabricated by employing thenew fundamental approach.The integration of the proposed research with undergraduate and graduateeducation at Rensselaer Polytechnic Institute will include: (a) development of newintroductory level interdisciplinary course for undergraduates in the area of compoundsemiconductor materials and device structures with specific focus towardsmicroelectronics, optoelectronics, and spintronics, (b) development of a graduate levelcourse on emerging materials and high performance device technologies, (c) researchopportunities for at least two doctoral students and several undergraduate and master'sstudents in the areas of substrate engineering and device fabrication on multi-componentalloys with specific focus towards new device architectures. The introduction of theabove topics into the undergraduate and graduate curriculum is in synergy withRensselaer's educational plans and will enable and enhance student's exposure to rapidlygrowing modern and future semiconductor technologies.

这项职业建议的研究方面着重于制造和工程可调式带隙以及用于光电，光子，高速电子，旋转电源，微电动机电系统和光电燃料系统的新型和工程方法。拟议的底物工程技术基于最近在熔体的三元和第四纪散装晶体生长的领域开发的几种概念，由主要研究者融化，多组分合金的热力学建模以及InterfaciaLeDefect生成。作为该职业奖的一部分，将设计和安装新闻鞋基板的反应堆，以兼容兼容的多木材成长增长和异质性。通过采用当时的基本方法来制造IIII-V化合物和相关设备结构的多组分工程基质。在伦斯勒理工学院的本科和毕业生研究所的拟议研究的整合将包括：（a）（a）新授课级别的构造材料的开发，以开发特定级别的构造材料，以使其在该区域中构建各个区域。朝向微电源，光电和旋转学，（b）开发有关新兴材料和高性能设备技术的研究生水平，（c）至少两个博士生的研究企业，以及针对新设备的基础材料工程和针对新设备的工具制造的一些博士生以及一些本科生和精通的研究人员。将戏剧主题引入本科和研究生课程中是在Synergy withrensselaer的教育计划中，将使学生能够增强学生对快速生长的现代和未来的半导体技术的接触。