Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics

用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化

基本信息

  • 批准号:
    RGPIN-2020-04167
  • 负责人:
  • 金额:
    $ 2.77万
  • 依托单位:
  • 依托单位国家:
    加拿大
  • 项目类别:
    Discovery Grants Program - Individual
  • 财政年份:
    2022
  • 资助国家:
    加拿大
  • 起止时间:
    2022-01-01 至 2023-12-31
  • 项目状态:
    已结题

项目摘要

This proposed research program will focus on direct laser writing process for rapid fabrication of copper-graphene (Cu-Gr) composite structures on various substrates for electronic applications by deeply understanding the correlations between laser processing conditions and interfacial structure of copper nanograins and/or copper-to-graphene junctions as well as electrical / thermal properties of composite structures and ultimately the performance of prototype flexible electronics. Three objectives of this research are to: (i) develop a one-step direct writing process for rapid patterning of Cu-Gr composite on various substrates; (ii) investigate the laser-induced heat generation, Cu nanoparticle formation and joining, polymer fast pyrolysis and Gr structure growing processes, particularly linking the laser heat generation to microstructures and defects at the interface of Cu-to-Cu and Cu-to-Gr to their conductivities; and (iii) design and fabricate prototype flexible electronics by utilizing different electrical and thermal properties of as-written Cu and / or Cu-Gr composite structures, and study their functions and performance related to microstructures and environmental stimuli. This research will use copper ion (e.g., Cu2+ and Cu+) and water soluble polymer (e.g., polyvinyl pyrrolidone-PVP, polyethylene glycol-PEG, and tannin) ink to coat the surface of substrates (plastics, silicon, paper) after proper surface treatment. Laser writing parameters will include laser power, scanning speed, wavelength, etc. Advanced analytical techniques will be used to investigate the formation of Cu and Gr and the defects at the interfaces of Cu grains or Cu-to-Gr. Electrical / thermal conductivities and mechanical property of as-written structures will be characterized. Simulations will be used to understand the growth of Gr on Cu surface under laser irradiation in a short time period. The as-written pure Cu and Cu-Gr composite structures will be integrated into functional devices on flexible substrates such as gas / strain sensor and photodetector to test their performances. The successful execution of this research program will provide a fundamental understanding of scientific phenomena in laser-mater interactions and microstructure-property correlation in materials science, specifically in laser heat generation, melting and solidification of metallic copper, atomic diffusion during joining, carbonization and crystallization of laser converted graphene, and effects of interfacial structures or defects on properties. This is of vital importance in practical applications, such as electronic fabrication and performance. This research program will also train 3 PhD and 3 MASc students and 3 PDFs with cutting edge knowledge and professional skills. These students and trainees will then contribute their knowledge and skills in industries, academic and research institutions to enhance Canada's future competitiveness in innovation and creativity.
该提出的研究计划将重点介绍直接的激光写作过程,以通过深入了解激光加工条件与铜纳米铜和 /或铜到辅助电位连接的铜纳米和 /或电力 /热电位构图的铜纳米和 /或铜纳米界面的界面结构之间的相关性,以及最终的构造和最终的型结构,通过深入了解激光加工条件与铜纳米铜纳米和 /或铜 - 铜到铜之间的界面结构之间的相关性,并最终。这项研究的三个目标是:(i)开发一个单步直接写作过程,以快速在各种基板上进行CU-GR复合材料; (ii)研究激光诱导的热量产生,Cu纳米颗粒的形成和连接,聚合物快速热解和GR结构生长过程,特别是将激光热的产生与Cu-to-to-to-to-Cu-to-Cu-to-to-gr界面上的微结构和缺陷联系起来; (iii)通过利用ASWERTIENT CU和 /或CU-GR复合结构的不同电和热性能设计和制造原型柔性电子设备,并研究其与微观结构以及环境刺激有关的功能和性能。这项研究将使用铜离子(例如Cu2+和Cu+)和水固体聚合物(例如,聚乙烯基吡咯酮-PVP,聚乙烯甘油-PEG和Tannin)墨水在经过适当的表面处理后覆盖底物的表面(塑料,硅,纸纸)。激光写入参数将包括激光功率,扫描速度,波长等。先进的分析技术将用于研究Cu和GR的形成以及Cu Grains或Cu-to-to-gr的接口处的缺陷。将表征电气 /导热电导率和机械性能。模拟将用于了解在短时间内激光照射下Cu表面上GR的生长。编写的纯Cu和Cu-gr复合结构将集成到柔性底物(例如气 /应变传感器和光电探测器)上的功能设备中,以测试其性能。该研究计划的成功执行将提供对材料科学的激光材料相互作用和微观结构 - 培训相关性的基本理解,特别是在激光热产生,金属铜的融化和固结,原子铜,原子扩散过程中的融合,碳化和固定型插入式构造和固定型的coverse骨化和结构的结构。这在实际应用中至关重要,例如电子制造和性能。该研究计划还将培训3名博士学位和3位MASC学生以及3个PDF,具有前沿知识和专业技能。然后,这些学生和学员将在行业,学术和研究机构中贡献他们的知识和技能,以增强加拿大在创新和创造力方面的未来竞争力。

项目成果

期刊论文数量(0)
专著数量(0)
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会议论文数量(0)
专利数量(0)

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Peng, Peng其他文献

Characterization of silicon photomultipliers and validation of the electrical model
Understanding the Relation between Mathematics Vocabulary and Mathematics Performance A Meta-analysis
  • DOI:
    10.1086/712504
  • 发表时间:
    2021-03-01
  • 期刊:
  • 影响因子:
    1.7
  • 作者:
    Lin, Xin;Peng, Peng;Zeng, Jiangang
  • 通讯作者:
    Zeng, Jiangang
Global Research Status and Trends of Femoral Neck Fracture Over the Past 27 Years: A Historical Review and Bibliometric Analysis.
近27年全球股骨颈骨折研究现状与趋势:历史回顾与文献计量分析
  • DOI:
    10.3389/fsurg.2022.875040
  • 发表时间:
    2022
  • 期刊:
  • 影响因子:
    1.8
  • 作者:
    Peng, Peng;Xiao, Fangjun;He, Xiaoming;Fang, Weihua;Huang, Jiewen;Wang, Bin;Luo, Yiwen;Zhang, Qinwen;Zhang, Ying;He, Wei;Wei, Qiushi;He, Mincong
  • 通讯作者:
    He, Mincong
Highly Pathogenic Avian Influenza A(H5Nx) Virus of Clade 2.3.4.4b Emerging in Tibet, China, 2021.
  • DOI:
    10.1128/spectrum.00643-22
  • 发表时间:
    2022-06-29
  • 期刊:
  • 影响因子:
    3.7
  • 作者:
    Li, Yi;Li, Xiang;Lv, Xinru;Xu, Qiuzi;Zhao, Zhenliang;Qin, Siyuan;Peng, Peng;Qu, Fengyi;Qin, Rongxiu;An, Qing;Wang, Meixi;Zhang, Zhen;Luo, Hua;Zeng, Xiangwei;Wang, Yulong;Hou, Zhijun;Sun, Heting;Wang, Yajun;Xu, Yu;Li, Yanbing;Chai, Hongliang
  • 通讯作者:
    Chai, Hongliang
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
  • DOI:
    10.1021/acsami.5b02134
  • 发表时间:
    2015-06-17
  • 期刊:
  • 影响因子:
    9.5
  • 作者:
    Peng, Peng;Hu, Anming;Zhou, Y. Norman
  • 通讯作者:
    Zhou, Y. Norman

Peng, Peng的其他文献

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{{ truncateString('Peng, Peng', 18)}}的其他基金

Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化
  • 批准号:
    RGPIN-2020-04167
  • 财政年份:
    2021
  • 资助金额:
    $ 2.77万
  • 项目类别:
    Discovery Grants Program - Individual
Developing high-entropy alloy coatings on different engineering alloys with electro-spark deposition
利用电火花沉积在不同的工程合金上开发高熵合金涂层
  • 批准号:
    568598-2021
  • 财政年份:
    2021
  • 资助金额:
    $ 2.77万
  • 项目类别:
    Alliance Grants
Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化
  • 批准号:
    RGPIN-2020-04167
  • 财政年份:
    2020
  • 资助金额:
    $ 2.77万
  • 项目类别:
    Discovery Grants Program - Individual
Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化
  • 批准号:
    DGECR-2020-00531
  • 财政年份:
    2020
  • 资助金额:
    $ 2.77万
  • 项目类别:
    Discovery Launch Supplement

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Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化
  • 批准号:
    RGPIN-2020-04167
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    2021
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    $ 2.77万
  • 项目类别:
    Discovery Grants Program - Individual
Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化
  • 批准号:
    RGPIN-2020-04167
  • 财政年份:
    2020
  • 资助金额:
    $ 2.77万
  • 项目类别:
    Discovery Grants Program - Individual
Direct Laser Patterning of Copper-Graphene Composite Structures for Flexible Electronics
用于柔性电子产品的铜-石墨烯复合结构的直接激光图案化
  • 批准号:
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