DAMAGELESS ETCHING PROCESSES

无损蚀刻工艺

• 批准号: RGPIN-2016-03691
• 负责人: Darnon, Maxime
• 金额: $ 1.67万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=754114
• 关键词: DAMAGELESS; ETCHING; PROCESSES

Plasma etching used in micro and nano fabrication is required for precise patterning of various materials. However, it also induces damage at the surface of the etched materials. The exact impact of these modifications on devices properties is not fully understood yet.In this program, we intend to improve the understanding of plasma-induced damage and to evaluate solutions to reduce the damage. We will use silicon, III-V materials and superconducting materials as test vehicles. These materials are used for integrated circuits, high efficiency solar cells and quantum computing devices fabrication. We will base our research on an extensive characterization of the surface of materials exposed to the plasma. Plasma diagnostics will also be used to correlate materials modification with plasma properties. Based on this information, we will develop processes with minimal plasma-induced damage and we will investigate alternative plasma etching processes. This program will provide processes that will participate in the fabrication of new devices such as higher efficiency solar cells or quantum computers. In addition, it will train five highly qualified people who will be well prepared to integrate the high tech industry and develop new products which will benefit Canada's economy.

微米和纳米制造中使用的等离子蚀刻需要对各种材料进行精确图案化。然而，它也会引起蚀刻材料表面的损坏。这些修改对器件性能的确切影响尚不完全清楚。在这个项目中，我们打算提高对等离子体引起的损伤的理解，并评估减少损伤的解决方案。我们将使用硅、III-V材料和超导材料作为测试载体。这些材料用于集成电路、高效太阳能电池和量子计算设备的制造。我们的研究将基于暴露于等离子体的材料表面的广泛表征。等离子体诊断还将用于将材料改性与等离子体特性关联起来。根据这些信息，我们将开发等离子体引起的损伤最小的工艺，并将研究替代的等离子体蚀刻工艺。该计划将提供参与制造新设备（例如更高效率的太阳能电池或量子计算机）的工艺。此外，还将培训五名高素质人才，为整合高科技产业和开发新产品做好充分准备，从而有利于加拿大经济。