Dicing saw for optoelectronics and sensors

用于光电和传感器的划片锯

• 批准号: RTI-2022-00369
• 负责人: Turak, Ayse
• 金额: $ 7.98万
• 依托单位: McMaster University
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments
• 财政年份: 2021
• 资助国家: 加拿大
• 起止时间: 2021-01-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=742944
• 关键词: Dicing; saw; optoelectronics; sensors

We request a high-speed, high accuracy automatic dicing saw, capable of precision cutting of semiconductor wafers, and precision milling of micron scale structures into various substrates. A dicing saw with these two capabilities is a fundamental processing tool for any research group requiring chip dicing, high precision sub-units, or precise features, such as on-chip photonic sources and waveguides, 3rd generation photovoltaic devices, nonlinear optical systems or biosensors. It is an essential piece of processing equipment, used for both device preparation and post-processing for a wide variety of applications. While all the co-applicants in this proposal (Turak, Xu, Bradley, Knights, Soleymani) will utilize the proposed equipment, they will apply it to a broad variety of cutting edge sectors, grouped into three categories: Materials and Devices for Integrated Photonics and Communications, Bio-compatible Sensing and Monitoring; and Transformative Photovoltaics. This tool will be housed within the McMaster Centre for Emerging Device Technology (CEDT), a core research facility specializing in the development of materials, devices, systems and processing protocols. This will also make it available to numerous (>20) groups at McMaster and in the local vicinity, who are user members of the Centre, on an ad hoc basis. The lack of reliable access to the dicing equipment has drastically limited the ability of the co-applicants to publish in a timely manner within internationally competitive areas of research. With such a tool, the co-applicants will be able to push the capabilities of high performance lasers, improve optical chip-fiber coupling for ultra-fast communications, miniaturize hand-held biosensors, and transform third generation photovoltaics.

我们需要一种高速、高精度的自动划片机，能够精密切割半导体晶圆，并将微米级结构精密铣削成各种基板。具有这两种功能的划片机是任何需要芯片的研究小组的基本加工工具。切割、高精度子单元或精确特征，例如片上光子源和波导、第三代光伏器件、非线性光学系统或生物传感器，是处理过程中必不可少的部分。虽然本提案中的所有共同申请人（Turak、Xu、Bradley、Knights、Soleymani）都将使用所提议的设备，但他们会将其应用于各种应用。广泛的前沿领域，分为三类：集成光子学和通信材料和设备、生物相容性传感和监测以及变革性光伏；该工具将位于麦克马斯特新兴中心内。设备技术 (CEDT) 是一家专门从事材料、设备、系统和处理协议开发的核心研究机构，这也将使其可供麦克马斯特和当地附近的众多（超过 20 个）团体使用，这些团体是该公司的用户成员。缺乏可靠的切割设备极大地限制了共同申请人在具有国际竞争力的研究领域中及时发表论文的能力。将能够推动高性能激光器的功能，改进用于超高速通信的光学芯片光纤耦合，小型化手持式生物传感器，并改造第三代光伏发电。