Organic (semi)conducting materials for 3D printed electronic sensing devices

用于 3D 打印电子传感设备的有机（半）导电材料

• 批准号: 571484-2021
• 负责人: Laventure, Audrey
• 金额: $ 3.28万
• 依托单位: Université de Montréal
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2021
• 资助国家: 加拿大
• 起止时间: 2021-01-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=729173
• 关键词: Organic; semi; conducting; materials; 3D

Electronic devices that are compliant to a variety of form factors is one of the sine qua non conditions for the integration of sensing and optoelectronic technologies in packaging, wearables and connected objects for the Internet of Things. Advances in organic (semi)conducting materials prove that this category of compounds stands as a key player to achieve highly conformable, sustainable, and cost-effective devices. Indeed, the mechanical properties of the organic electronics components can be matched to those of the supporting (soft) substrate and of the targeted object to be laminated with the devices. While developing synthetic and processing strategies to optimize organic electronics compounds in the context of soft and printable devices is a blooming area of research, there is a strong interest in tackling the challenges associated with their monolithic integration within an object. Such integration would eliminate the need for the lamination step and the constraints associated with the mechanical properties of the substrate, leading to the freeform design of self-standing organic electronics devices. In this pan-Canadian collaborative project, we outline our approaches towards the use of organic (semi)conducting materials to prepare three-dimension (3D) printed electronic sensing technologies. While the 2021 Flexible and Printed electronics roadmap mentions that the market size for 3D printed electronics is estimated to reach $1 billion in 2025, it also highlights that it is 'a nascent field'. The scarcity of the investigations on the 3D printing of organic (semi)conducting compounds clearly identifies a gap in fundamental knowledge, to be filled by this research. For instance, conductive filaments made from commodity polymers and carbon nanomaterials for fused deposition modeling are commercially available. However, the use of halogenated solvents in their preparation, along with undisclosed blend composition topped by batch-to-batch variations in conductivity values impedes the establishment of reliable structure-processing-property relationships in the context of sustainable preparation of organic electronic sensing devices.To overcome these challenges, we will capitalize on the synergy of the organic electronics expertise of our team members, respectively in synthesis of vat dyes for organic electronics (Morin), in advanced fabrication (3D printing) and characterization of functional polymer materials (Laventure) and soft semiconductors and transistor sensors design (Rondeau-Gagné). Together, we aim to 1) develop a synthetic approach for an organic electronics semi-conducting solution and an all-polymer conducting filament formulations; 2) establish structure-processing-property relationships by correlating the formulation composition with the microstructure of the filament and that of the resulting 3D printed samples and 3) characterize the electronic and mechanical properties of the samples towards, ultimately, the design and fabrication of an electronic sensing platform. Overall, the breakthrough potential of our project lies in shifting the focus of the 3D printing field from structural to functional considerations, i.e. from complex, yet passive architectures, to architectures with technology-relevant built-in devices. Our project will also contribute to train highly qualified scientists with a unique multidisciplinary technical and professional skillset in materials chemistry, which can be leveraged towards innovative careers.

符合各种外形尺寸的电子设备是将传感和光电技术集成到物联网包装、可穿戴设备和连接对象中的必要条件之一，有机（半）导电材料的进步证明了这一点。这类化合物是实现高度一致、可持续且经济高效的设备的关键参与者。事实上，有机电子元件的机械性能可以与支撑（软）基板和目标物体的机械性能相匹配。是虽然开发合成和加工策略以在软和可打印设备的背景下优化有机电子化合物是一个蓬勃发展的研究领域，但人们对解决与它们在物体内的单片集成相关的挑战有着浓厚的兴趣。这种集成将消除层压步骤的需要以及与基板机械性能相关的限制，从而实现独立有机电子器件的自由形式设计。在这个泛加拿大合作项目中，我们概述了我们的方法。使用有机物虽然 2021 年柔性和印刷电子产品路线图提到 3D 打印电子产品的市场规模预计到 2025 年将达到 10 亿美元，但它也强调了这一点。 “一个新兴领域”。有机（半）导电化合物 3D 打印研究的匮乏显然是一项基础知识的空白，需要通过这项研究来填补。例如，用于熔融沉积建模的由商品聚合物和碳纳米材料制成的导电丝在商业上是可以买到的，然而，在其制备过程中使用卤化溶剂，以及未公开的共混成分，以及批次之间电导率值的变化，阻碍了这一点。在有机电子传感器件的可持续制备的背景下建立可靠的结构-加工-性能关系。为了克服这些挑战，我们将分别利用我们团队成员的有机电子专业知识的协同作用在有机电子还原染料的合成 (Morin)、先进制造（3D 打印）和功能性聚合物材料的表征 (Laventure) 以及软半导体和晶体管传感器设计 (Rondeau-Gagné) 方面，我们的目标是 1) 共同开发一种有机电子半导体溶液和全聚合物导电丝配方的合成方法；2) 通过将配方组成与微观结构相关联，建立结构-加工-性能关系；灯丝和由此产生的 3D 打印样品的特征，以及 3) 表征样品的电子和机械特性，最终，电子传感平台的设计和制造总体而言，我们项目的突破性潜力在于转移 3D 的重点。我们的项目还将有助于培养具有独特的材料化学多学科技术和专业技能的高素质科学家。可以用于创新职业。