Development of wireless sensors using microfabrication techniques

利用微加工技术开发无线传感器

• 批准号: 571268-2021
• 负责人: Adachi, Michael
• 金额: $ 1.46万
• 依托单位: Simon Fraser University
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2021
• 资助国家: 加拿大
• 起止时间: 2021-01-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=729121
• 关键词: Development; wireless; sensors; using; microfabrication

The objective of the proposed project is to develop new wireless semiconductor sensors for industrial Internet of Things (IoT) applications using microfabrication processes. The proposed project is a joint effort between Dr. Adachi's team in the School of Engineering Science, Simon Fraser University (SFU) and industrial partner, EPIC Semiconductors, Inc. An example application is the integration of wireless sensors into automotive tires that can determine the type of terrain underneath them. The semiconductor sensors will be fabricated by microelectronic fabrication processes including thin film deposition, photolithography, and etching, which offer the advantage of scalability and batch fabrication for low-cost production. Anticipated outcomes include the development of new miniature torque and pressure sensor technologies which are self-powered and communicate wirelessly to a nearby mobile device. The industrial partner will acquire new sensing technology and leverage the expertise and fabrication know-how of the research team. A team of 7 students (2 PhD students and 5 Undergraduate students) will gain hands-on industry-relevant skills such as semiconductor device prototyping, fabrication, and electrical characterization. The student's training experience will be enhanced by industrial experience gained through regular interactions with the engineering team at the industrial partner. The development of the new wireless sensor technologies may lead to a new commercial product and new jobs in the high-tech sector for Canadians. A successful completion of this project will achieve three goals of the Canadian government's Recovery Plan for Jobs, Growth, and Resilience: the support of a small sized business investment in new technologies for meeting customer needs, staying competitive, and enhance training of young people.

该项目的目标是使用微加工工艺为工业物联网（IoT）应用开发新型无线半导体传感器。拟议的项目是西蒙弗雷泽大学 (SFU) 工程科学学院的 Adachi 博士团队与工业合作伙伴 EPIC Semiconductors, Inc. 的共同努力。一个示例应用是将无线传感器集成到汽车轮胎中，该传感器可以确定它们下方的地形类型。半导体传感器将通过薄膜沉积、光刻和蚀刻等微电子制造工艺制造，具有可扩展性和批量制造的优势，可实现低成本生产。预期成果包括开发新的微型扭矩和压力传感器技术，这些技术是自供电的，并与附近的移动设备进行无线通信。工业合作伙伴将获得新的传感技术，并利用研究团队的专业知识和制造技术。由 7 名学生（2 名博士生和 5 名本科生）组成的团队将获得行业相关的实践技能，例如半导体器件原型设计、制造和电气表征。通过与工业合作伙伴的工程团队定期互动而获得的工业经验将增强学生的培训经验。新无线传感器技术的开发可能会为加拿大人带来新的商业产品和高科技领域的新就业机会。该项目的成功完成将实现加拿大政府就业、增长和复原力复苏计划的三个目标：支持小型企业对新技术的投资，以满足客户需求、保持竞争力并加强对年轻人的培训。