Atmospheric pressure spatial atomic layer deposition system

大气压空间原子层沉积系统

• 批准号: 557217-2020
• 负责人: Musselman, Kevin
• 金额: $ 9.11万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Idea to Innovation
• 财政年份: 2020
• 资助国家: 加拿大
• 起止时间: 2020-01-01 至 2021-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=706601
• 关键词: Atmospheric; pressure; spatial; atomic; layer

Thin film coatings are integral components of many technologies (all modern electronics, energy capture and storage devices, optical components, food packaging, etc.). As feature sizes continue to decrease (e.g., in integrated circuits and memory devices), better and better control over the coating thickness and properties is needed. Atomic layer deposition (ALD) is the best technique for producing films with nanometer-scale thickness control, as it deposits a film one atomic layer at a time. Weaknesses associated with ALD include its speed (it is slow) and its need for a vacuum chamber, which hinders its use in some applications (e.g., roll-to-roll manufacturing and large-area coatings). Researchers at the University of Waterloo have developed an atmospheric pressure spatial atomic layer deposition tool. The invention can deposit nanoscale coatings at low temperatures, is 1-2 orders of magnitude faster than ALD, and is capable of coating large substrates for commercial applications. These advantages make the UW invention very attractive for high-throughput manufacturing. In the proposed project, the performance of the UW invention will be benchmarked (e.g., operating cost, compliance with regulations). Preliminary testing of the coatings in promising applications (thin-film batteries, photovoltaics, antimicrobial coatings) will also be performed. The results of the planned beta trials and application testing will help establish target market vertical(s), timing of a possible startup company's creation, and a go-to-market strategy.

薄膜涂层是许多技术的组成部分（所有现代电子产品、能量捕获和存储设备、光学元件、食品包装等）。随着特征尺寸不断减小（例如，在集成电路和存储器件中），需要对涂层厚度和性能进行越来越好的控制。原子层沉积 (ALD) 是生产纳米级厚度控制薄膜的最佳技术，因为它一次沉积一个原子层。 ALD 的缺点包括其速度（较慢）和需要真空室，这阻碍了其在某些应用（例如卷对卷制造和大面积涂层）中的使用。滑铁卢大学的研究人员开发了一种大气压空间原子层沉积工具。该发明可以在低温下沉积纳米级涂层，速度比ALD快1-2个数量级，并且能够涂覆大型基材以供商业应用。这些优点使得华盛顿大学的发明对于高通量制造非常有吸引力。在拟议的项目中，将对威斯康星大学发明的性能进行基准测试（例如运营成本、法规遵从性）。还将对有前途的应用（薄膜电池、光伏、抗菌涂层）中的涂层进行初步测试。计划的 Beta 试验和应用程序测试的结果将有助于确定目标市场垂直领域、可能的初创公司创建的时机以及进入市场的策略。