Digital high-throughput flexible hybrid electronic manufacturing strategies

数字化高通量柔性混合电子制造策略

• 批准号: 538311-2018
• 负责人: Cloutier, Sylvain
• 金额: $ 10.93万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2020
• 资助国家: 加拿大
• 起止时间: 2020-01-01 至 2021-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=698979
• 关键词: Digital; throughput; flexible; hybrid; electronic

The Industry 4.0 and the Internet of Things revolutions aims at taking better-informed decisions in real-time using better and cheaper flexible hybrid electronics circuits for smart sensing applications. Screen- or stamp-based techniques are already used in industry for coarse dispensing or specialty applications from flexible electronics to compact monolithic hybrids. However, these well-established printing techniques suffer from two distinct drawbacks: (1) A rigid configuration where any change in the circuit design requires new hardware (stencils, stamps, or slot-die) and (2) a significant material waste with complex environmental and safety issues. In recent years, digital inkjet printing technologies has shown great potential for rapid prototyping, low-volume production and hybrid integration of critical electronic components. Compared to current techniques, digital inkjet printing allows instantaneous design modification by simply changing the electronic design file, with optimal use of the expensive functional inks. However, research-grade inkjet printers cannot support manufacturing-scale production volumes. While manufacturing-scale digital inkjet machines are well-established in consumer markets like the graphic and food-labelling industries, major fundamental issues remain to achieve high-volume printing of functional inks for printed electronics. In this collaborative R&D effort, our research objective is to work closely with two key players of the Canadian electronics manufacturing and assembly sector (C2MI and Varitron) and their partners at Fujifilm-Dimatix in order to (1) adapt digital inkjet printing strategies from a research-scale Ceradrop printer to a customized industrial manufacturing-grade high-throughput printing system and then (2) demonstrate high-volume production of flexible electronic circuit boards compatible with the industry's current assembly and encapsulation processes.

行业4.0和物联网革命旨在实时采取更明智的决策，使用更好，更便宜的灵活的混合电子电路来实现智能传感应用。基于屏幕或邮票的技术已经用于行业中，用于从柔性电子设备到紧凑的整体混合动力的粗糙分配或专业应用。但是，这些完善的印刷技术遭受了两个不同的缺点：（1）刚性配置，电路设计中的任何更改都需要新的硬件（模具，邮票或插槽或插槽），以及（2）具有复杂材料浪费环境和安全问题。近年来，数字喷墨印刷技术已显示出快速原型制作，低容量生产和关键电子组件的混合整合的巨大潜力。与当前的技术相比，数字喷墨打印可以通过简单地更改电子设计文件，最佳使用昂贵的功能墨水，从而允许瞬时设计修改。但是，研究级喷墨打印机不能支持制造规模的生产量。尽管制造规模的数字喷墨机在图形和食品标签行业等消费市场中已经建立了良好的建立，但仍有主要的基本问题可以实现用于印刷电子产品的功能墨水的大量印刷。 在这项合作的研发工作中，我们的研究目标是与加拿大电子制造和组装行业（C2MI和Varitron）及其在Fujifilm-Dimatix的合作伙伴紧密合作，以（1）适应数字数字喷墨印刷策略研究规模的Ceradrop打印机，用于定制的工业制造级高通量打印系统，然后（2）展示了与行业当前的组装和封装过程兼容的柔性电子电路板的大量生产。