Silicon Waveguide Integrated Technologies for Intelligent Millimeter-wave/Terahertz Micro-Systems

智能毫米波/太赫兹微系统硅波导集成技术

• 批准号: RGPIN-2016-04491
• 负责人: SafaviNaeini, Safieddin
• 金额: $ 4.74万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2018
• 资助国家: 加拿大
• 起止时间: 2018-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=664059
• 关键词: Silicon; Waveguide; Integrated; Technologies; Intelligent

Sitting between the radio frequencies and light-waves, millimeter-wave (mmW)/Terahertz (THz) spectra of electromagnetic waves (particularly 0.1 to 3 THz) have the most desirable properties of both spectra. Like radio waves, mmW/THz waves can penetrate into opaque objects and, at the same time, provide geometrical resolution only comparable to that of the light-waves. Such unique characteristics have enabled a wide range of new applications in ultra-broadband communication (mmW satellite communication, 5G and beyond), high resolution radar (future automotive radars), security imaging, biomedical/pharmaceutical material characterizations, and radio astronomy.*** Despite unique advantages of this range of frequencies and impressive advances in mmW commercial (CMOS, SiGe) nano-scale semiconductor technologies, lack of efficient mmW/THz active devices with reasonable performance, as well as the cost and complexity of the existing passive devices and the lack of a suitable integration technology platform has hindered fast industrial scale usage of this spectrum.*** Although there is still a long way to low-cost mmW/THz active device technologies for mass market applications, highly efficient and low insertion loss passive devices and antenna and low-cost integration technologies can, to a large extent, compensate for the active devices lack of efficiency and sensitivity, as well as their noisy behavior. *** Current planar multi-layer circuit and antenna technologies for RF/microwave range of frequencies are not applicable to mmW/THz systems due the large insertion loss of metals and common commercial grade soft substrates. Currently, the mainstream technique for wave transmission/processing at 100+ GHz is metallic waveguide and its variations, which are bulky, heavy, and quite costly, particularly at THz, with almost no possibility of integration. This has become a major bottleneck for realizing integrated mmW/THz commercial products at low cost.*** As a fundamentally new approach to this problem, the applicant group has been investigating and developing a novel Si-based technology platform for integrated wave transmission/processing/emission, over the past 8 years. The new technology platform is based on Si-waveguide on glass or Si substrate at mmW/THz range of frequencies. This research has resulted in a proven technology platform and several novel design concepts such as mmW/THz sensors and antenna arrays with beam control capability.*** The main objective of the proposed research is to investigate the most cost-effective system (circuit/antenna/package) integration technologies in the developed Si-based platform. Major foci in the proposed program are integration of the active devices, both conventional and new ones such as graphene and development of modular large scale integrated intelligent microsystems for emerging mmW/THz communication systems, imaging, and sensing.********

坐在无线电频率和光波之间，电磁波的毫米波（MMW）/Terahertz（THZ）光谱（尤其是0.1至3 thz）具有两种光谱的最理想特性。 像无线电波一样，MMW/THZ波可以渗透到不透明的物体中，同时提供的几何分辨率仅与光波的分辨率相当。这种独特的特征已使超宽带通信（MMW卫星通信，5G及以后），高分辨率雷达（未来的汽车雷达），安全成像，生物医学/药品材料特征和射电天文学。 *尽管这种频率范围和令人印象深刻的MMW商业（CMOS，SIGE）纳米级半导体技术具有独特的优势，但缺乏具有合理性能的有效MMW/THZ活动设备，以及现有的无源设备的成本和复杂性而且缺乏合适的集成技术平台阻碍了此范围的快速工业规模的使用。被动设备，天线和低成本集成技术在很大程度上可以补偿主动设备缺乏效率和敏感性及其嘈杂行为。 ***当前的平面多层电路和RF/微波范围的频率范围的天线技术不适用于MMW/THZ系统，这是由于金属的插入大量损失和普通的商业级软底物。当前，在100+ GHz处进行波动传输/加工的主流技术是金属波导及其变化，它们的变化是笨重，沉重且相当昂贵的，尤其是在THZ时，几乎没有整合的可能性。这已成为以低成本实现集成的MMW/THZ商业产品的主要瓶颈。***作为解决此问题的一种新方法，申请人组一直在调查和开发一个基于SI的新型SI基于集成波传输/的技术平台在过去的8年中，处理/排放。新技术平台基于MMW/THZ范围的玻璃或SI基板上的Si-WaveGuide。这项研究导致了一个经过验证的技术平台，并具有具有光束控制能力的MMW/THZ传感器和天线阵列等几种新颖的设计概念。***拟议研究的主要目的是研究最具成本效益的系统（电路/电路/天线/包装）在开发的基于SI的平台中的集成技术。拟议程序中的主要焦点是集成的主动设备，无论是常规设备还是新的设备，例如石墨烯和模块化大规模集成的智能微型系统，用于新兴的MMW/THZ通信系统，成像和传感。******************************************************** *