Novel packaging concepts for ultra high-speed digital communication modules

超高速数字通信模块的新颖封装概念

• 批准号: 513484-2017
• 负责人: Kouki, Ammar
• 金额: $ 1.82万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=639567
• 关键词: Novel; packaging; concepts; ultra; speed

To meet the ever-growing need for more data speeds that are needed today everyday life and for most economicactivities, higher speed opto-electronic communication circuits that provide larger bandwidths are required.One of the challenges of developing such circuits is how to package them in small size packages that are bothenergy and cost efficient. One of the key enabling technologies in this area is the ceramic technology known asLTCC (Low Temperature Cofired Ceramics) which allows designers to build 3D packages that can meetstringent performance requirements at very high frequencies. This technology is available at our LTCC@ÉTSlaboratory in École de technologie supérieure and the present projects aims to launch a collaboration betweenour Laboratory and SANMINA, a leader in the design and manufacturing of advanced optical andmicro-electronic modules for various industries, whereby this technology will be used to design and validatenew packaging concepts for high-speed opto-electronic modules.

为了满足日常生活以及大多数经济活性所需的更多数据速度的不断增长的需求，需要更高的速度光电动通信电路，这些沟通电路需要提供更大的带宽。开发此类电路的挑战之一是如何将它们包装在小型包装中，这些小包装既易于又有限制的技术。设计人员可以构建3D软件包，以非常高的频率满足性能要求。 This technology is available at our LTCC@ÉTSlaboratory in École de technology supérieure and the present projects aims to launch a collaboration betweenour Laboratory and SANMINA, a leader in the design and manufacturing of advanced optical and micro-electronic modules for various industries, whereby this technology will be used to design and validatenew packaging concepts for high-speed opt-electronic modules.